MAX9721BETC datasheet, PDF - EEWORLD Datasheet

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MAX9721BETC: Description0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12; CategoryAnalog mixed-signal IC Consumption circuit; File Size1MB，15 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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MAX9721BETC Overview

0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12

MAX9721BETC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Parts packaging code	QFN
package instruction	4 X 4 MM, 0.80 MM HEIGHT, TQFN-12
Contacts	12
Reach Compliance Code	unknown
Nominal bandwidth	22 kHz
Commercial integrated circuit types	AUDIO AMPLIFIER
JESD-30 code	S-XQCC-N12
JESD-609 code	e0
length	4 mm
Humidity sensitivity level	1
Number of channels	2
Number of functions	1
Number of terminals	12
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Nominal output power	0.025 W
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	245
Certification status	COMMERCIAL
Maximum seat height	0.8 mm
Maximum supply voltage (Vsup)	1.8 V
Minimum supply voltage (Vsup)	0.9 V
surface mount	YES
technology	BICMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	4 mm
Base Number Matches	1

MAX9721BETC Related Products

	MAX9721BETC	MAX9721BEBC-T	MAX9721AEBC-T	MAX9721AETC+	MAX9721AETC	MAX9721CEBC-T
Description	0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12	0.025W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA12, 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12	0.025W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA12, 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12	0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12	0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12	0.025W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA12, 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12
Is it lead-free?	Contains lead	Lead free	Contains lead	Contains lead	Contains lead	Contains lead
Parts packaging code	QFN	BGA	BGA	QFN	QFN	BGA
package instruction	4 X 4 MM, 0.80 MM HEIGHT, TQFN-12	1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12	1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12	4 X 4 MM, 0.80 MM HEIGHT, TQFN-12	4 X 4 MM, 0.80 MM HEIGHT, TQFN-12	1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12
Contacts	12	12	12	12	12	12
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Nominal bandwidth	22 kHz	22 kHz	22 kHz	22 kHz	22 kHz	22 kHz
Commercial integrated circuit types	AUDIO AMPLIFIER	AUDIO AMPLIFIER	AUDIO AMPLIFIER	AUDIO AMPLIFIER	AUDIO AMPLIFIER	AUDIO AMPLIFIER
JESD-30 code	S-XQCC-N12	R-PBGA-B12	R-PBGA-B12	S-XQCC-N12	S-XQCC-N12	R-PBGA-B12
JESD-609 code	e0	e0	e0	e3	e0	e0
length	4 mm	2.02 mm	2.02 mm	4 mm	4 mm	2.02 mm
Humidity sensitivity level	1	1	1	1	1	1
Number of channels	2	2	2	2	2	2
Number of functions	1	1	1	1	1	1
Number of terminals	12	12	12	12	12	12
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Nominal output power	0.025 W	0.025 W	0.025 W	0.025 W	0.025 W	0.025 W
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	HVQCCN	VFBGA	VFBGA	HVQCCN	HVQCCN	VFBGA
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	245	245	245	260	245	245
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	0.8 mm	0.67 mm	0.67 mm	0.8 mm	0.8 mm	0.67 mm
Maximum supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Minimum supply voltage (Vsup)	0.9 V	0.9 V	0.9 V	0.9 V	0.9 V	0.9 V
surface mount	YES	YES	YES	YES	YES	YES
technology	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN	TIN LEAD	TIN LEAD
Terminal form	NO LEAD	BALL	BALL	NO LEAD	NO LEAD	BALL
Terminal pitch	0.8 mm	0.5 mm	0.5 mm	0.8 mm	0.8 mm	0.5 mm
Terminal location	QUAD	BOTTOM	BOTTOM	QUAD	QUAD	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	4 mm	1.54 mm	1.54 mm	4 mm	4 mm	1.54 mm
Base Number Matches	1	1	1	1	1	-

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