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MAX9721AETC+

Description
0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size1MB,15 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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MAX9721AETC+ Overview

0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12

MAX9721AETC+ Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Parts packaging codeQFN
package instruction4 X 4 MM, 0.80 MM HEIGHT, TQFN-12
Contacts12
Reach Compliance Codeunknown
Nominal bandwidth22 kHz
Commercial integrated circuit typesAUDIO AMPLIFIER
JESD-30 codeS-XQCC-N12
JESD-609 codee3
length4 mm
Humidity sensitivity level1
Number of channels2
Number of functions1
Number of terminals12
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Nominal output power0.025 W
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
Certification statusCOMMERCIAL
Maximum seat height0.8 mm
Maximum supply voltage (Vsup)1.8 V
Minimum supply voltage (Vsup)0.9 V
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN
Terminal formNO LEAD
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width4 mm
Base Number Matches1

MAX9721AETC+ Related Products

MAX9721AETC+ MAX9721BEBC-T MAX9721BETC MAX9721AEBC-T MAX9721AETC MAX9721CEBC-T
Description 0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 0.025W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA12, 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 0.025W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA12, 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 0.025W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA12, 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12
Is it lead-free? Contains lead Lead free Contains lead Contains lead Contains lead Contains lead
Parts packaging code QFN BGA QFN BGA QFN BGA
package instruction 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12
Contacts 12 12 12 12 12 12
Reach Compliance Code unknown unknown unknown unknown unknown unknown
Nominal bandwidth 22 kHz 22 kHz 22 kHz 22 kHz 22 kHz 22 kHz
Commercial integrated circuit types AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER
JESD-30 code S-XQCC-N12 R-PBGA-B12 S-XQCC-N12 R-PBGA-B12 S-XQCC-N12 R-PBGA-B12
JESD-609 code e3 e0 e0 e0 e0 e0
length 4 mm 2.02 mm 4 mm 2.02 mm 4 mm 2.02 mm
Humidity sensitivity level 1 1 1 1 1 1
Number of channels 2 2 2 2 2 2
Number of functions 1 1 1 1 1 1
Number of terminals 12 12 12 12 12 12
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Nominal output power 0.025 W 0.025 W 0.025 W 0.025 W 0.025 W 0.025 W
Package body material UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY
encapsulated code HVQCCN VFBGA HVQCCN VFBGA HVQCCN VFBGA
Package shape SQUARE RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 245 245 245 245 245
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 0.8 mm 0.67 mm 0.8 mm 0.67 mm 0.8 mm 0.67 mm
Maximum supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Minimum supply voltage (Vsup) 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
surface mount YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form NO LEAD BALL NO LEAD BALL NO LEAD BALL
Terminal pitch 0.8 mm 0.5 mm 0.8 mm 0.5 mm 0.8 mm 0.5 mm
Terminal location QUAD BOTTOM QUAD BOTTOM QUAD BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 4 mm 1.54 mm 4 mm 1.54 mm 4 mm 1.54 mm
Base Number Matches 1 1 1 1 1 -
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