|
MAX9721AETC+ |
MAX9721BEBC-T |
MAX9721BETC |
MAX9721AEBC-T |
MAX9721AETC |
MAX9721CEBC-T |
Description |
0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 |
0.025W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA12, 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 |
0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 |
0.025W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA12, 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 |
0.025W, 2 CHANNEL, AUDIO AMPLIFIER, QCC12, 4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 |
0.025W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA12, 1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 |
Is it lead-free? |
Contains lead |
Lead free |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Parts packaging code |
QFN |
BGA |
QFN |
BGA |
QFN |
BGA |
package instruction |
4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 |
1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 |
4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 |
1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 |
4 X 4 MM, 0.80 MM HEIGHT, TQFN-12 |
1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12 |
Contacts |
12 |
12 |
12 |
12 |
12 |
12 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
Nominal bandwidth |
22 kHz |
22 kHz |
22 kHz |
22 kHz |
22 kHz |
22 kHz |
Commercial integrated circuit types |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
JESD-30 code |
S-XQCC-N12 |
R-PBGA-B12 |
S-XQCC-N12 |
R-PBGA-B12 |
S-XQCC-N12 |
R-PBGA-B12 |
JESD-609 code |
e3 |
e0 |
e0 |
e0 |
e0 |
e0 |
length |
4 mm |
2.02 mm |
4 mm |
2.02 mm |
4 mm |
2.02 mm |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
Number of channels |
2 |
2 |
2 |
2 |
2 |
2 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
12 |
12 |
12 |
12 |
12 |
12 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Nominal output power |
0.025 W |
0.025 W |
0.025 W |
0.025 W |
0.025 W |
0.025 W |
Package body material |
UNSPECIFIED |
PLASTIC/EPOXY |
UNSPECIFIED |
PLASTIC/EPOXY |
UNSPECIFIED |
PLASTIC/EPOXY |
encapsulated code |
HVQCCN |
VFBGA |
HVQCCN |
VFBGA |
HVQCCN |
VFBGA |
Package shape |
SQUARE |
RECTANGULAR |
SQUARE |
RECTANGULAR |
SQUARE |
RECTANGULAR |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
260 |
245 |
245 |
245 |
245 |
245 |
Certification status |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Maximum seat height |
0.8 mm |
0.67 mm |
0.8 mm |
0.67 mm |
0.8 mm |
0.67 mm |
Maximum supply voltage (Vsup) |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
Minimum supply voltage (Vsup) |
0.9 V |
0.9 V |
0.9 V |
0.9 V |
0.9 V |
0.9 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
BICMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
TIN |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
Terminal form |
NO LEAD |
BALL |
NO LEAD |
BALL |
NO LEAD |
BALL |
Terminal pitch |
0.8 mm |
0.5 mm |
0.8 mm |
0.5 mm |
0.8 mm |
0.5 mm |
Terminal location |
QUAD |
BOTTOM |
QUAD |
BOTTOM |
QUAD |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
4 mm |
1.54 mm |
4 mm |
1.54 mm |
4 mm |
1.54 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
- |