TMS320VC5502GZZ200 datasheet, PDF

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TMS320VC5502GZZ200: Description32-BIT, 50MHz, OTHER DSP, PBGA201, PLASTIC, MICRO BGA-201; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，193 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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TMS320VC5502GZZ200 Overview

32-BIT, 50MHz, OTHER DSP, PBGA201, PLASTIC, MICRO BGA-201

TMS320VC5502GZZ200 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Parts packaging code	BGA
package instruction	PLASTIC, MICRO BGA-201
Contacts	201
Reach Compliance Code	unknown
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	20
barrel shifter	NO
boundary scan	YES
maximum clock frequency	50 MHz
External data bus width	32
Format	FIXED POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B201
JESD-609 code	e0
length	15 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	201
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	220
Certification status	COMMERCIAL
Maximum seat height	1.4 mm
Maximum supply voltage	1.32 V
Minimum supply voltage	1.2 V
Nominal supply voltage	1.26 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

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TMS320VC5502GZZ200 Related Products

	TMS320VC5502GZZ200	TMX320VC5502PGF300	TMS320VC5502ZZZ300	TMS320VC5502PGF200	TMX320VC5502PGF200	TMX320VC5502GZZ300	TMS320VC5502ZZZ200
Description	32-BIT, 50MHz, OTHER DSP, PBGA201, PLASTIC, MICRO BGA-201	32-BIT, 50MHz, OTHER DSP, PQFP176, PLASTIC, LQFP-176	32-BIT, 50MHz, OTHER DSP, PBGA201, GREEN, PLASTIC, MICRO BGA-201	32-BIT, 50MHz, OTHER DSP, PQFP176, GREEN, PLASTIC, LQFP-176	32-BIT, 50MHz, OTHER DSP, PQFP176, PLASTIC, LQFP-176	32-BIT, 50MHz, OTHER DSP, PBGA201, PLASTIC, MICRO BGA-201	32-BIT, 50MHz, OTHER DSP, PBGA201, GREEN, PLASTIC, MICRO BGA-201
Is it lead-free?	Contains lead	Contains lead	Lead free	Contains lead	Lead free	Contains lead	Contains lead
Parts packaging code	BGA	QFP	BGA	QFP	QFP	BGA	BGA
package instruction	PLASTIC, MICRO BGA-201	PLASTIC, LQFP-176	GREEN, PLASTIC, MICRO BGA-201	GREEN, PLASTIC, LQFP-176	PLASTIC, LQFP-176	PLASTIC, MICRO BGA-201	GREEN, PLASTIC, MICRO BGA-201
Contacts	201	176	201	176	176	201	201
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Other features	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
Address bus width	20	20	20	20	20	20	20
barrel shifter	NO	NO	NO	NO	NO	NO	NO
boundary scan	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
External data bus width	32	32	32	32	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B201	S-PQFP-G176	S-PBGA-B201	S-PQFP-G176	S-PQFP-G176	S-PBGA-B201	S-PBGA-B201
JESD-609 code	e0	e0	e1	e4	e0	e0	e1
length	15 mm	24 mm	15 mm	24 mm	24 mm	15 mm	15 mm
low power mode	YES	YES	YES	YES	YES	YES	YES
Number of terminals	201	176	201	176	176	201	201
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFQFP	LFBGA	LFQFP	LFQFP	LFBGA	LFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	220	NOT SPECIFIED	260	260	NOT SPECIFIED	NOT SPECIFIED	260
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	1.4 mm	1.6 mm	1.4 mm	1.6 mm	1.6 mm	1.4 mm	1.4 mm
Maximum supply voltage	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V
Minimum supply voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
Nominal supply voltage	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V	1.26 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN SILVER COPPER	NICKEL PALLADIUM GOLD	TIN LEAD	TIN LEAD	TIN SILVER COPPER
Terminal form	BALL	GULL WING	BALL	GULL WING	GULL WING	BALL	BALL
Terminal pitch	0.8 mm	0.5 mm	0.8 mm	0.5 mm	0.5 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	QUAD	BOTTOM	QUAD	QUAD	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15 mm	24 mm	15 mm	24 mm	24 mm	15 mm	15 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Humidity sensitivity level	3	NOT SPECIFIED	3	4	-	NOT SPECIFIED	3
Maker	-	-	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics

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