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TMS320VC5502PGF200

Description
32-BIT, 50MHz, OTHER DSP, PQFP176, GREEN, PLASTIC, LQFP-176
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,193 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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TMS320VC5502PGF200 Overview

32-BIT, 50MHz, OTHER DSP, PQFP176, GREEN, PLASTIC, LQFP-176

TMS320VC5502PGF200 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerRochester Electronics
Parts packaging codeQFP
package instructionGREEN, PLASTIC, LQFP-176
Contacts176
Reach Compliance Codeunknown
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width20
barrel shifterNO
boundary scanYES
maximum clock frequency50 MHz
External data bus width32
FormatFIXED POINT
Internal bus architectureMULTIPLE
JESD-30 codeS-PQFP-G176
JESD-609 codee4
length24 mm
low power modeYES
Humidity sensitivity level4
Number of terminals176
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
Certification statusCOMMERCIAL
Maximum seat height1.6 mm
Maximum supply voltage1.32 V
Minimum supply voltage1.2 V
Nominal supply voltage1.26 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width24 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER
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TMS320VC5502PGF200 Related Products

TMS320VC5502PGF200 TMX320VC5502PGF300 TMS320VC5502ZZZ300 TMS320VC5502GZZ200 TMX320VC5502PGF200 TMX320VC5502GZZ300 TMS320VC5502ZZZ200
Description 32-BIT, 50MHz, OTHER DSP, PQFP176, GREEN, PLASTIC, LQFP-176 32-BIT, 50MHz, OTHER DSP, PQFP176, PLASTIC, LQFP-176 32-BIT, 50MHz, OTHER DSP, PBGA201, GREEN, PLASTIC, MICRO BGA-201 32-BIT, 50MHz, OTHER DSP, PBGA201, PLASTIC, MICRO BGA-201 32-BIT, 50MHz, OTHER DSP, PQFP176, PLASTIC, LQFP-176 32-BIT, 50MHz, OTHER DSP, PBGA201, PLASTIC, MICRO BGA-201 32-BIT, 50MHz, OTHER DSP, PBGA201, GREEN, PLASTIC, MICRO BGA-201
Is it lead-free? Contains lead Contains lead Lead free Contains lead Lead free Contains lead Contains lead
Parts packaging code QFP QFP BGA BGA QFP BGA BGA
package instruction GREEN, PLASTIC, LQFP-176 PLASTIC, LQFP-176 GREEN, PLASTIC, MICRO BGA-201 PLASTIC, MICRO BGA-201 PLASTIC, LQFP-176 PLASTIC, MICRO BGA-201 GREEN, PLASTIC, MICRO BGA-201
Contacts 176 176 201 201 176 201 201
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address bus width 20 20 20 20 20 20 20
barrel shifter NO NO NO NO NO NO NO
boundary scan YES YES YES YES YES YES YES
maximum clock frequency 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
External data bus width 32 32 32 32 32 32 32
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Internal bus architecture MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE
JESD-30 code S-PQFP-G176 S-PQFP-G176 S-PBGA-B201 S-PBGA-B201 S-PQFP-G176 S-PBGA-B201 S-PBGA-B201
JESD-609 code e4 e0 e1 e0 e0 e0 e1
length 24 mm 24 mm 15 mm 15 mm 24 mm 15 mm 15 mm
low power mode YES YES YES YES YES YES YES
Number of terminals 176 176 201 201 176 201 201
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP LFBGA LFBGA LFQFP LFBGA LFBGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 NOT SPECIFIED 260 220 NOT SPECIFIED NOT SPECIFIED 260
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 1.6 mm 1.6 mm 1.4 mm 1.4 mm 1.6 mm 1.4 mm 1.4 mm
Maximum supply voltage 1.32 V 1.32 V 1.32 V 1.32 V 1.32 V 1.32 V 1.32 V
Minimum supply voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Nominal supply voltage 1.26 V 1.26 V 1.26 V 1.26 V 1.26 V 1.26 V 1.26 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface NICKEL PALLADIUM GOLD TIN LEAD TIN SILVER COPPER TIN LEAD TIN LEAD TIN LEAD TIN SILVER COPPER
Terminal form GULL WING GULL WING BALL BALL GULL WING BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.8 mm 0.8 mm 0.5 mm 0.8 mm 0.8 mm
Terminal location QUAD QUAD BOTTOM BOTTOM QUAD BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 24 mm 24 mm 15 mm 15 mm 24 mm 15 mm 15 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Maker Rochester Electronics - - - Rochester Electronics Rochester Electronics Rochester Electronics
Humidity sensitivity level 4 NOT SPECIFIED 3 3 - NOT SPECIFIED 3

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