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TMS320VC5502ZZZ200

Description
32-BIT, 50MHz, OTHER DSP, PBGA201, GREEN, PLASTIC, MICRO BGA-201
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,193 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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TMS320VC5502ZZZ200 Overview

32-BIT, 50MHz, OTHER DSP, PBGA201, GREEN, PLASTIC, MICRO BGA-201

TMS320VC5502ZZZ200 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerRochester Electronics
Parts packaging codeBGA
package instructionGREEN, PLASTIC, MICRO BGA-201
Contacts201
Reach Compliance Codeunknown
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width20
barrel shifterNO
boundary scanYES
maximum clock frequency50 MHz
External data bus width32
FormatFIXED POINT
Internal bus architectureMULTIPLE
JESD-30 codeS-PBGA-B201
JESD-609 codee1
length15 mm
low power modeYES
Humidity sensitivity level3
Number of terminals201
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
Certification statusCOMMERCIAL
Maximum seat height1.4 mm
Maximum supply voltage1.32 V
Minimum supply voltage1.2 V
Nominal supply voltage1.26 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width15 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER
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TMS320VC5502ZZZ200 Related Products

TMS320VC5502ZZZ200 TMX320VC5502PGF300 TMS320VC5502ZZZ300 TMS320VC5502GZZ200 TMS320VC5502PGF200 TMX320VC5502PGF200 TMX320VC5502GZZ300
Description 32-BIT, 50MHz, OTHER DSP, PBGA201, GREEN, PLASTIC, MICRO BGA-201 32-BIT, 50MHz, OTHER DSP, PQFP176, PLASTIC, LQFP-176 32-BIT, 50MHz, OTHER DSP, PBGA201, GREEN, PLASTIC, MICRO BGA-201 32-BIT, 50MHz, OTHER DSP, PBGA201, PLASTIC, MICRO BGA-201 32-BIT, 50MHz, OTHER DSP, PQFP176, GREEN, PLASTIC, LQFP-176 32-BIT, 50MHz, OTHER DSP, PQFP176, PLASTIC, LQFP-176 32-BIT, 50MHz, OTHER DSP, PBGA201, PLASTIC, MICRO BGA-201
Is it lead-free? Contains lead Contains lead Lead free Contains lead Contains lead Lead free Contains lead
Parts packaging code BGA QFP BGA BGA QFP QFP BGA
package instruction GREEN, PLASTIC, MICRO BGA-201 PLASTIC, LQFP-176 GREEN, PLASTIC, MICRO BGA-201 PLASTIC, MICRO BGA-201 GREEN, PLASTIC, LQFP-176 PLASTIC, LQFP-176 PLASTIC, MICRO BGA-201
Contacts 201 176 201 201 176 176 201
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address bus width 20 20 20 20 20 20 20
barrel shifter NO NO NO NO NO NO NO
boundary scan YES YES YES YES YES YES YES
maximum clock frequency 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
External data bus width 32 32 32 32 32 32 32
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Internal bus architecture MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE
JESD-30 code S-PBGA-B201 S-PQFP-G176 S-PBGA-B201 S-PBGA-B201 S-PQFP-G176 S-PQFP-G176 S-PBGA-B201
JESD-609 code e1 e0 e1 e0 e4 e0 e0
length 15 mm 24 mm 15 mm 15 mm 24 mm 24 mm 15 mm
low power mode YES YES YES YES YES YES YES
Number of terminals 201 176 201 201 176 176 201
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFQFP LFBGA LFBGA LFQFP LFQFP LFBGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 NOT SPECIFIED 260 220 260 NOT SPECIFIED NOT SPECIFIED
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 1.4 mm 1.6 mm 1.4 mm 1.4 mm 1.6 mm 1.6 mm 1.4 mm
Maximum supply voltage 1.32 V 1.32 V 1.32 V 1.32 V 1.32 V 1.32 V 1.32 V
Minimum supply voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Nominal supply voltage 1.26 V 1.26 V 1.26 V 1.26 V 1.26 V 1.26 V 1.26 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN SILVER COPPER TIN LEAD TIN SILVER COPPER TIN LEAD NICKEL PALLADIUM GOLD TIN LEAD TIN LEAD
Terminal form BALL GULL WING BALL BALL GULL WING GULL WING BALL
Terminal pitch 0.8 mm 0.5 mm 0.8 mm 0.8 mm 0.5 mm 0.5 mm 0.8 mm
Terminal location BOTTOM QUAD BOTTOM BOTTOM QUAD QUAD BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15 mm 24 mm 15 mm 15 mm 24 mm 24 mm 15 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Maker Rochester Electronics - - - Rochester Electronics Rochester Electronics Rochester Electronics
Humidity sensitivity level 3 NOT SPECIFIED 3 3 4 - NOT SPECIFIED
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