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NM27LV010BTE250

Description
OTP ROM, 128KX8, 250ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32
Categorystorage    storage   
File Size101KB,10 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
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NM27LV010BTE250 Overview

OTP ROM, 128KX8, 250ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32

NM27LV010BTE250 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeTSOP1
package instructionTSOP1, TSSOP32,.8,20
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time250 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G32
JESD-609 codee0
length18.4 mm
memory density1048576 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP32,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.00005 A
Maximum slew rate0.015 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
Base Number Matches1

NM27LV010BTE250 Related Products

NM27LV010BTE250 NM27LV010BTE200 NM27LV010BT200 NM27LV010TE150 NM27LV010VE150 NM27LV010V150 NM27LV010T300
Description OTP ROM, 128KX8, 250ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 OTP ROM, 128KX8, 200ns, CMOS, PDSO32, 8 X 20 MM, TSOP-32 OTP ROM, 128KX8, 200ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 OTP ROM, 128KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP1-32 OTP ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 128KX8, 300ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, TSOP1-32
Parts packaging code TSOP1 TSOP TSOP1 TSOP1 QFJ QFJ TSOP1
package instruction TSOP1, TSSOP32,.8,20 TSOP1, TSOP1, TSSOP32,.8,20 TSOP1, TSSOP32,.8,20 PLASTIC, LCC-32 QCCJ, LDCC32,.5X.6 TSOP1,
Contacts 32 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown compliant unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 250 ns 200 ns 200 ns 150 ns 150 ns 150 ns 300 ns
JESD-30 code R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PQCC-J32 R-PQCC-J32 R-PDSO-G32
length 18.4 mm 18.4 mm 18.4 mm 18.4 mm 13.995 mm 13.995 mm 18.4 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 85 °C 85 °C 70 °C 70 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 TSOP1 TSOP1 TSOP1 QCCJ QCCJ TSOP1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE CHIP CARRIER CHIP CARRIER SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 3.56 mm 3.56 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.3 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING GULL WING J BEND J BEND GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 1.27 mm 1.27 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL QUAD QUAD DUAL
width 8 mm 8 mm 8 mm 8 mm 11.455 mm 11.455 mm 8 mm
Is it Rohs certified? incompatible - incompatible incompatible incompatible incompatible -
I/O type COMMON - COMMON COMMON COMMON COMMON -
JESD-609 code e0 - e0 e0 e0 e0 -
Output characteristics 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE -
Encapsulate equivalent code TSSOP32,.8,20 - TSSOP32,.8,20 TSSOP32,.8,20 LDCC32,.5X.6 LDCC32,.5X.6 -
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
power supply 3/3.3 V - 3 V 3.3 V 3.3 V 3.3 V -
Maximum standby current 0.00005 A - 0.00005 A 0.00005 A 0.00005 A 0.00005 A -
Maximum slew rate 0.015 mA - 0.015 mA 0.015 mA 0.015 mA 0.015 mA -
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Base Number Matches 1 1 1 1 - - -
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