NM27LV010BTE200 datasheet, PDF

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NM27LV010BTE200: DescriptionOTP ROM, 128KX8, 200ns, CMOS, PDSO32, 8 X 20 MM, TSOP-32; Categorystorage storage; File Size101KB，10 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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NM27LV010BTE200 Overview

OTP ROM, 128KX8, 200ns, CMOS, PDSO32, 8 X 20 MM, TSOP-32

NM27LV010BTE200 Parametric

Parameter Name	Attribute value
Parts packaging code	TSOP
package instruction	TSOP1,
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	200 ns
JESD-30 code	R-PDSO-G32
length	18.4 mm
memory density	1048576 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
width	8 mm
Base Number Matches	1

NM27LV010BTE200 Related Products

	NM27LV010BTE200	NM27LV010BTE250	NM27LV010BT200	NM27LV010TE150	NM27LV010VE150	NM27LV010V150	NM27LV010T300
Description	OTP ROM, 128KX8, 200ns, CMOS, PDSO32, 8 X 20 MM, TSOP-32	OTP ROM, 128KX8, 250ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32	OTP ROM, 128KX8, 200ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32	OTP ROM, 128KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP1-32	OTP ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 128KX8, 300ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, TSOP1-32
Parts packaging code	TSOP	TSOP1	TSOP1	TSOP1	QFJ	QFJ	TSOP1
package instruction	TSOP1,	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20	PLASTIC, LCC-32	QCCJ, LDCC32,.5X.6	TSOP1,
Contacts	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	compliant	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	200 ns	250 ns	200 ns	150 ns	150 ns	150 ns	300 ns
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PQCC-J32	R-PQCC-J32	R-PDSO-G32
length	18.4 mm	18.4 mm	18.4 mm	18.4 mm	13.995 mm	13.995 mm	18.4 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C	85 °C	70 °C	70 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	TSOP1	TSOP1	TSOP1	QCCJ	QCCJ	TSOP1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	CHIP CARRIER	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	3.56 mm	3.56 mm	1.2 mm
Maximum supply voltage (Vsup)	3.3 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	J BEND	J BEND	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	1.27 mm	1.27 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL
width	8 mm	8 mm	8 mm	8 mm	11.455 mm	11.455 mm	8 mm
Base Number Matches	1	1	1	1	-	-	-
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible	-
I/O type	-	COMMON	COMMON	COMMON	COMMON	COMMON	-
JESD-609 code	-	e0	e0	e0	e0	e0	-
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-
Encapsulate equivalent code	-	TSSOP32,.8,20	TSSOP32,.8,20	TSSOP32,.8,20	LDCC32,.5X.6	LDCC32,.5X.6	-
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
power supply	-	3/3.3 V	3 V	3.3 V	3.3 V	3.3 V	-
Maximum standby current	-	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	-
Maximum slew rate	-	0.015 mA	0.015 mA	0.015 mA	0.015 mA	0.015 mA	-
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-

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