NM27LV010TE150 datasheet, PDF - EEWORLD Datasheet

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NM27LV010TE150: DescriptionOTP ROM, 128KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP1-32; Categorystorage storage; File Size101KB，10 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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NM27LV010TE150 Overview

OTP ROM, 128KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP1-32

NM27LV010TE150 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	TSOP1
package instruction	TSOP1, TSSOP32,.8,20
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	150 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	18.4 mm
memory density	1048576 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP32,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.00005 A
Maximum slew rate	0.015 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm
Base Number Matches	1

NM27LV010TE150 Related Products

	NM27LV010TE150	NM27LV010BTE200	NM27LV010BTE250	NM27LV010BT200	NM27LV010VE150	NM27LV010V150	NM27LV010T300
Description	OTP ROM, 128KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP1-32	OTP ROM, 128KX8, 200ns, CMOS, PDSO32, 8 X 20 MM, TSOP-32	OTP ROM, 128KX8, 250ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32	OTP ROM, 128KX8, 200ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32	OTP ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 128KX8, 300ns, CMOS, PDSO32, 8 X 20 MM, EIAJ, TSOP1-32
Parts packaging code	TSOP1	TSOP	TSOP1	TSOP1	QFJ	QFJ	TSOP1
package instruction	TSOP1, TSSOP32,.8,20	TSOP1,	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20	PLASTIC, LCC-32	QCCJ, LDCC32,.5X.6	TSOP1,
Contacts	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	compliant	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	200 ns	250 ns	200 ns	150 ns	150 ns	300 ns
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PQCC-J32	R-PQCC-J32	R-PDSO-G32
length	18.4 mm	18.4 mm	18.4 mm	18.4 mm	13.995 mm	13.995 mm	18.4 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C	70 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	TSOP1	TSOP1	TSOP1	QCCJ	QCCJ	TSOP1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	CHIP CARRIER	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	3.56 mm	3.56 mm	1.2 mm
Maximum supply voltage (Vsup)	3.6 V	3.3 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	2.7 V	2.7 V	2.7 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3 V	3 V	3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	J BEND	J BEND	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	1.27 mm	1.27 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL
width	8 mm	8 mm	8 mm	8 mm	11.455 mm	11.455 mm	8 mm
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible	incompatible	-
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON	-
JESD-609 code	e0	-	e0	e0	e0	e0	-
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	-
Encapsulate equivalent code	TSSOP32,.8,20	-	TSSOP32,.8,20	TSSOP32,.8,20	LDCC32,.5X.6	LDCC32,.5X.6	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
power supply	3.3 V	-	3/3.3 V	3 V	3.3 V	3.3 V	-
Maximum standby current	0.00005 A	-	0.00005 A	0.00005 A	0.00005 A	0.00005 A	-
Maximum slew rate	0.015 mA	-	0.015 mA	0.015 mA	0.015 mA	0.015 mA	-
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Base Number Matches	1	1	1	1	-	-	-

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