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KMM372C213CK-6

Description
Fast Page DRAM Module, 2MX72, 60ns, CMOS, GLASS EPOXY, DIMM-168
Categorystorage    storage   
File Size404KB,19 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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KMM372C213CK-6 Overview

Fast Page DRAM Module, 2MX72, 60ns, CMOS, GLASS EPOXY, DIMM-168

KMM372C213CK-6 Parametric

Parameter NameAttribute value
Parts packaging codeDIMM
package instructionDIMM, DIMM168
Contacts168
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE
Maximum access time60 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O typeCOMMON
JESD-30 codeR-XDMA-N168
memory density150994944 bit
Memory IC TypeFAST PAGE DRAM MODULE
memory width72
Number of functions1
Number of ports2
Number of terminals168
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX72
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM168
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply5 V
Certification statusNot Qualified
refresh cycle2048
Maximum seat height25.4 mm
self refreshNO
Maximum standby current0.03 A
Maximum slew rate0.9 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1
DRAM MODULE
KMM372C213CK/CS Fast Page Mode
2M x 72 DRAM DIMM with ECC using 2Mx8, 2K Refresh , 5V
GENERAL DESCRIPTION
The Samsung KMM372C213C is a 2Mx72bits Dynamic RAM
high density memory module. The Samsung KMM372C213C
consists of nine CMOS 2Mx8bits DRAMs in SOJ/TSOP-II
300mil package, and two 16bits driver IC in 48pin TSSOP
package mounted on a 168-pin glass-epoxy substrate. A 0.1
or 0.22uF decoupling capacitor is mounted on the printed cir-
cuit board for each DRAM. The KMM372C213C is a Dual In-
line Memory Module and is intended for mounting into 168 pin
edge connector sockets.
KMM372C213CK/CS
FEATURES
• Part Identification
- KMM372C213CK (2048 cycles/32ms Ref. 300mil SOJ)
- KMM372C213CS (2048 cycles/32ms Ref. 300mil TSOP)
• Fast Page Mode Operation
• CAS-before-RAS Refresh capability
• RAS-only and Hidden refresh capability
• TTL compatible inputs and outputs
• Single 5V±10% power supply
• JEDEC standard pinout & Buffered PDpin
• Buffered input except RAS and DQ
PERFORMANCE RANGE
Speed
-5
-6
t
RAC
50ns
60ns
t
CAC
18ns
20ns
t
RC
90ns
110ns
t
PC
35ns
40ns
• PCB : Height(1000mil), single sided component
PIN CONFIGURATIONS
Pin Front Pin Front Pin Front Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
V
SS
DQ0
DQ1
DQ2
DQ3
V
CC
DQ4
DQ5
DQ6
DQ7
DQ8
V
SS
DQ9
DQ10
DQ11
DQ12
DQ13
V
CC
DQ14
DQ15
DQ16
DQ17
V
SS
RSVD
RSVD
V
CC
W0
CAS0
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
RSVD
RAS0
OE0
V
SS
A0
A2
A4
A6
A8
A10
*A12
V
CC
RFU
RFU
V
SS
OE2
RAS2
CAS4
RSVD
W2
V
CC
RSVD
RSVD
DQ18
DQ19
V
SS
DQ20
DQ21
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
DQ22
DQ23
V
CC
DQ24
RFU
RFU
RFU
RFU
DQ25
DQ26
DQ27
V
SS
DQ28
DQ29
DQ30
DQ31
V
CC
DQ32
DQ33
DQ34
DQ35
V
SS
PD1
PD3
PD5
PD7
ID0
V
CC
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
Back
V
SS
DQ36
DQ37
DQ38
DQ39
V
CC
DQ40
DQ41
DQ42
DQ43
DQ44
V
SS
DQ45
DQ46
DQ47
DQ48
DQ49
V
CC
DQ50
DQ51
DQ52
DQ53
V
SS
RSVD
RSVD
V
CC
RFU
*CAS1
Pin
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
Back
RSVD
*RAS1
RFU
V
SS
A1
A3
A5
A7
A9
*A11
*A13
V
CC
RFU
B0
V
SS
RFU
*RAS3
*CAS5
RSVD
PDE
V
CC
RSVD
RSVD
DQ54
DQ55
V
SS
DQ56
DQ57
Pin Back
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
DQ58
DQ59
V
CC
DQ60
RFU
RFU
RFU
RFU
DQ61
DQ62
DQ63
V
SS
DQ64
DQ65
DQ66
DQ67
V
CC
DQ68
DQ69
DQ70
DQ71
V
SS
PD2
PD4
PD6
PD8
ID1
V
CC
PIN NAMES
Pin Names
A0, B0, A1 - A10
DQ0 - DQ71
W0, W2
OE0, OE2
RAS0 , RAS2
CAS0 , CAS7
V
CC
V
SS
NC
PDE
PD1 - 8
ID0 - 1
RSVD
RFU
Function
Address Input
Data In/Out
Read/Write Enable
Output Enable
Row Address Strobe
Column Address Strobe
Power(+5V)
Ground
No Connection
Presence Detect Enable
Presence Detect
ID bit
Reserved Use
Reserved for Future Use
Pins marked
′*′
are not used in this module.
PD & ID Table
Pin
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PD8
ID0
50NS
1
0
0
1
0
0
0
0
0
60NS
1
0
0
1
0
1
1
0
0
PD Note : PD & ID Terminals must each be pulled up through a resister to V
CC
at the next higher
level assembly. PDs will be either open (NC) or driven to V
SS
via on-board buffer circuits.
PD : 0 for Vol of Drive IC & 1 for N.C
ID Note : IDs will be either open (NC) or connected directly to V
SS
without a buffer.
ID : 0 for Vss & 1 for N.C

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Description Fast Page DRAM Module, 2MX72, 60ns, CMOS, GLASS EPOXY, DIMM-168 Fast Page DRAM Module, 2MX72, 50ns, CMOS, GLASS EPOXY, DIMM-168 Fast Page DRAM Module, 2MX72, 50ns, CMOS, GLASS EPOXY, DIMM-168 Fast Page DRAM Module, 2MX72, 60ns, CMOS, GLASS EPOXY, DIMM-168
Parts packaging code DIMM DIMM DIMM DIMM
package instruction DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 GLASS EPOXY, DIMM-168
Contacts 168 168 168 168
Reach Compliance Code unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE FAST PAGE
Maximum access time 60 ns 50 ns 50 ns 60 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
memory density 150994944 bit 150994944 bit 150994944 bit 150994944 bit
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 72 72 72 72
Number of functions 1 1 1 1
Number of ports 2 2 2 2
Number of terminals 168 168 168 168
word count 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 2MX72 2MX72 2MX72 2MX72
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM DIMM
Encapsulate equivalent code DIMM168 DIMM168 DIMM168 DIMM168
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 2048 2048 2048 2048
Maximum seat height 25.4 mm 25.4 mm 25.4 mm 25.4 mm
self refresh NO NO NO NO
Maximum standby current 0.03 A 0.03 A 0.03 A 0.03 A
Maximum slew rate 0.9 mA 0.99 mA 0.99 mA 0.9 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
Maker - SAMSUNG SAMSUNG SAMSUNG
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