Adder/Subtractor, CMOS, PDIP16,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDIP-T16 |
JESD-609 code | e0 |
Logic integrated circuit type | ADDER/SUBTRACTOR |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
CD74HCT283EX | CD74HC283M96 | CD74HC283EX | CD54HCT283F/3A | CD74HCT283H | CD74HC283M | CD74HCT283M | CD74HC283H | |
---|---|---|---|---|---|---|---|---|
Description | Adder/Subtractor, CMOS, PDIP16, | Adder/Subtractor, CMOS, PDSO16, | Adder/Subtractor, CMOS, PDIP16, | Adder/Subtractor, CMOS, CDIP16 | Adder/Subtractor, CMOS, | Adder/Subtractor, CMOS, PDSO16 | Adder/Subtractor, CMOS, PDSO16, | Adder/Subtractor, CMOS, |
package instruction | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | , DIE OR CHIP | SOP, SOP16,.25 | SOP, SOP16,.25 | , DIE OR CHIP |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Logic integrated circuit type | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Encapsulate equivalent code | DIP16,.3 | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIE OR CHIP | SOP16,.25 | SOP16,.25 | DIE OR CHIP |
power supply | 5 V | 2/6 V | 2/6 V | 5 V | 5 V | 2/6 V | 5 V | 2/6 V |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | - | incompatible | incompatible | - |
JESD-30 code | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-XDIP-T16 | - | R-PDSO-G16 | R-PDSO-G16 | - |
JESD-609 code | e0 | e0 | e0 | e0 | - | e0 | e0 | - |
Number of terminals | 16 | 16 | 16 | 16 | - | 16 | 16 | - |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
encapsulated code | DIP | SOP | DIP | DIP | - | SOP | SOP | - |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
Package form | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | - | SMALL OUTLINE | SMALL OUTLINE | - |
surface mount | NO | YES | NO | NO | - | YES | YES | - |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING | GULL WING | - |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | - | 1.27 mm | 1.27 mm | - |
Terminal location | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | - |
Certification status | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maker | - | - | RCA | RCA | RCA | RCA | RCA | RCA |