F-213
QMS–032–06.75–L–D–DP–A
TM
(0,635 mm) .025"
QMS SERIES
QMS–026–06.75–L–D–A
RUGGED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QMS
Insulator Material:
Liquid Crystal
Polymer
Terminal & Ground
Plane Material:
Phosphor Bronze
Plating:
Au over 50µ" (1,27 µm) Ni
(Tin on Ground Plane Tail)
Current Rating:
Contact:
1.6A per contact @ 95°C
Ground Plane:
9.2A per ground plane @ 95°C
Voltage Rating:
300 VAC mated with QFS
Operating Temp:
-55°C to +125°C
RoHS Compliant:
Yes
Board Mates:
QFS
Integral metal plane
for power or ground
Increased
insertion depth for
rugged applications
®
fina
l
i
nch.com
APPLICATION
SPECIFIC
• Power & RF options
• Edge Mount
• Guide Posts
• Without PCB
Alignment Pins
(05.75 and 06.75 only)
• Hot Pluggable
• 64 (-DP) and 104
positions per row
Call Samtec.
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (026-052)
(0,15 mm) .006" max (078)
Board Stacking:
For applications requiring more
than two connectors per board,
contact ipg@samtec.com
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D
9 GHz / 18 Gbps
8 GHz / 16 Gbps
Differential Pair Signaling –D
8 GHz / 16 Gbps
8.5 GHz / 17 Gbps
Differential Pair Signaling –DP 7.5 GHz / 15 Gbps
9 GHz / 18 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QMS or contact sig@samtec.com
QMS/QFS
10 mm Stack Height
Type
(1,60 mm)
.063"
NOMINAL
WIPE
QMS
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE
A
OTHER
OPTION
–026, –052, –078
(52 total pins per bank = –D)
–016, –032, –048
Specify
LEAD
STYLE
from
chart
–K
–L
(–05.75 and –06.75 lead style only)
= 10µ" (0,25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
–D
= Single-Ended
–D–DP
= Differential Pair
try
ndus rds
I
da
Stan
SUMIT
TM
ress
CI/104-Exp
P
TM
(16 pairs per bank = –D–DP)
= (5,50 mm)
.217" DIA
Polyimide
film
Pick &
Place Pad
MATED HEIGHT*
LEAD
STYLE
–SL
12 mm
13 mm
16 mm
A
(5,38) .212
(6,35) .250
(9,35) .368
QFS LEAD STYLE
–04.25 –06.25
10 mm
11 mm
14 mm
ols
otoc ted
Pr or
Supp
100 GbE
nel
Fibre Chan
XAUI
®
s
PCI Expres
TA
SA
–05.75
–06.75
–09.75
(–09.75 lead style only)
= 10µ" (0,25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
APPLICATION
*Processing conditions will affect mated height.
(6,35)
.250
(No. of Banks) x (21,34) .840 - (0,51) .020
(21,34) .840
01
(7,26)
.286
(2,29)
.090
(0,635)
.025
(0,23)
.009
02
(0,25)
.010
STACK
HEIGHT
(0,44)
.017
(7,52)
.296
Requires Standoff
SO-1524-03-01-01-L for 15,24 mm
or SO-2215-02-01-01-L for 22 mm
board spacing. Connectors designed
to not fully seat when mated.
notes at
Download app ppnote
com/a
www.samtec.
m
@ samtec.co
Contact SIG
cols
on proto
for questions
Note:
Some lengths,
styles and options are
non-standard, non-returnable.
INDUSTRY
STANDARD
INTERCONNECTS
TERMINAL
SOCKET
STACK
BANKS HEIGHT
1
3
2
3
15,24 mm
15,24 mm
22 mm
22 mm
A
–D
–D–DP
SUMIT
™
ASP-129637-01 ASP-129646-01
™
PCI/104-Express
ASP-129637-03 ASP-129646-03
PCI/104-Express
™
ASP-142781-02 ASP-129646-02
PCI/104-Express
™
ASP-142781-03 ASP-129646-03
WWW.SAMTEC.COM