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WS512K32L-25G4TC

Description
Standard SRAM, 512KX32, 25ns, CMOS, CQFP68, QFP-68
Categorystorage    storage   
File Size1MB,11 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WS512K32L-25G4TC Overview

Standard SRAM, 512KX32, 25ns, CMOS, CQFP68, QFP-68

WS512K32L-25G4TC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeQFP
package instructionQFP-68
Contacts68
Reach Compliance Codeunknown
Maximum access time25 ns
Other featuresALSO CONFIGURABLE AS 2M X 8
Spare memory width16
I/O typeCOMMON
JESD-30 codeS-CQFP-F68
length39.6 mm
memory density16777216 bit
Memory IC TypeSTANDARD SRAM
memory width32
Number of functions1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFF
Encapsulate equivalent codeQFL68,1.56SQ
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum seat height3.56 mm
Maximum standby current0.016 A
Minimum standby current2 V
Maximum slew rate0.66 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationQUAD
width39.6 mm
WS512K32-XXX
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES

Access Times of 15, 17, 20, 25, 35, 45, 55ns

Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
(Package 400).
• 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm
(0.140") (Package 502)
1
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square
(Package 510) 3.56mm (0.140") height.
• 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880") square,
5.08mm (0.200") high (Package 528).

Organized as 512Kx32, User Configurable as 1Mx16 or
2Mx8

Commercial, Industrial and Military Temperature Ranges

TTL Compatible Inputs and Outputs

5 Volt Power Supply

Low Power CMOS

Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation

Weight

WS512K32N-XH1X - 13 grams typical
WS512K32-XG2UX - 8 grams typical
WS512K32-XG4TX
1
- 20 grams typical
WS512K32-XG2LX - 8 grams typical
* This product is subject to change without notice.
Note 1: Package Not Recommended For New Design
FIGURE 1 – PIN CONFIGURATION FOR WS512K32N-XH1X
Top View
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
A
17
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
A
18
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
3
A
4
A
5
WE
3
#
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
512K X 8
OE#
A
0-18
WE
1
# CS
1
#
Pin Description
56
I/O
0-31
A
0-18
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE
2
# CS
2
#
WE
3
# CS
3
#
WE
4
# CS
4
#
512K X 8
512K X 8
512K X 8
8
8
8
8
I/O
0 - 7
I/O
8 - 15
I/O
16 - 23
I/O
24 - 31
Microsemi Corporation reserves the right to change products or specifications without notice.
November 2010
Rev. 19
© 2010 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.whiteedc.com
www.microsemi.com
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