8-BIT, 3.2MHz, MICROPROCESSOR, CDIP40, SIDE BRAZED, DIP-40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | DIP |
| package instruction | DIP, DIP40,.6 |
| Contacts | 40 |
| Reach Compliance Code | not_compliant |
| Is Samacsys | N |
| Address bus width | 8 |
| bit size | 8 |
| boundary scan | NO |
| maximum clock frequency | 3.2 MHz |
| External data bus width | 8 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-CDIP-T40 |
| JESD-609 code | e0 |
| low power mode | NO |
| Number of terminals | 40 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5/10 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.72 mm |
| speed | 3.2 MHz |
| Maximum slew rate | 4 mA |
| Maximum supply voltage | 6.5 V |
| Minimum supply voltage | 4 V |
| Nominal supply voltage | 10 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
| Base Number Matches | 1 |
| CDP1802ADX | CDP1802AD | CDP1802AE | CDP1802AEX | CDP1802AQ | |
|---|---|---|---|---|---|
| Description | 8-BIT, 3.2MHz, MICROPROCESSOR, CDIP40, SIDE BRAZED, DIP-40 | 8-BIT, 3.2MHz, MICROPROCESSOR, CDIP40, SIDE BRAZED, DIP-40 | 8-BIT, 3.2MHz, MICROPROCESSOR, PDIP40, PLASTIC, DIP-40 | 8-BIT, 3.2MHz, MICROPROCESSOR, PDIP40, PLASTIC, DIP-40 | 8-BIT, 3.2MHz, MICROPROCESSOR, PQCC44, PLASTIC, LCC-44 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | PLASTIC, LCC-44 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| Address bus width | 8 | 8 | 8 | 8 | 8 |
| bit size | 8 | 8 | 8 | 8 | 8 |
| boundary scan | NO | NO | NO | NO | NO |
| maximum clock frequency | 3.2 MHz | 3.2 MHz | 3.2 MHz | 3.2 MHz | 3.2 MHz |
| External data bus width | 8 | 8 | 8 | 8 | 8 |
| Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO | NO | NO | NO |
| JESD-30 code | R-CDIP-T40 | R-CDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | S-PQCC-J44 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| low power mode | NO | NO | NO | NO | NO |
| Number of terminals | 40 | 40 | 40 | 40 | 44 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | QCCJ |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5/10 V | 5/10 V | 5/10 V | 5/10 V | 5/10 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.72 mm | 5.72 mm | 6.35 mm | 6.35 mm | 4.57 mm |
| speed | 3.2 MHz | 3.2 MHz | 3.2 MHz | 3.2 MHz | 3.2 MHz |
| Maximum slew rate | 4 mA | 4 mA | 4 mA | 4 mA | 4 mA |
| Maximum supply voltage | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V |
| Minimum supply voltage | 4 V | 4 V | 4 V | 4 V | 4 V |
| Nominal supply voltage | 10 V | 10 V | 10 V | 10 V | 10 V |
| surface mount | NO | NO | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 16.585 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
| Parts packaging code | DIP | DIP | - | - | LCC |
| Contacts | 40 | 40 | - | - | 44 |
| length | - | - | 51.75 mm | 51.75 mm | 16.585 mm |
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