8-BIT, 3.2MHz, MICROPROCESSOR, PDIP40, PLASTIC, DIP-40
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Renesas Electronics Corporation |
package instruction | DIP, DIP40,.6 |
Reach Compliance Code | not_compliant |
Address bus width | 8 |
bit size | 8 |
boundary scan | NO |
maximum clock frequency | 3.2 MHz |
External data bus width | 8 |
Format | FIXED POINT |
Integrated cache | NO |
JESD-30 code | R-PDIP-T40 |
JESD-609 code | e0 |
length | 51.75 mm |
low power mode | NO |
Number of terminals | 40 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5/10 V |
Certification status | Not Qualified |
Maximum seat height | 6.35 mm |
speed | 3.2 MHz |
Maximum slew rate | 4 mA |
Maximum supply voltage | 6.5 V |
Minimum supply voltage | 4 V |
Nominal supply voltage | 10 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
CDP1802AE | CDP1802AD | CDP1802ADX | CDP1802AEX | CDP1802AQ | |
---|---|---|---|---|---|
Description | 8-BIT, 3.2MHz, MICROPROCESSOR, PDIP40, PLASTIC, DIP-40 | 8-BIT, 3.2MHz, MICROPROCESSOR, CDIP40, SIDE BRAZED, DIP-40 | 8-BIT, 3.2MHz, MICROPROCESSOR, CDIP40, SIDE BRAZED, DIP-40 | 8-BIT, 3.2MHz, MICROPROCESSOR, PDIP40, PLASTIC, DIP-40 | 8-BIT, 3.2MHz, MICROPROCESSOR, PQCC44, PLASTIC, LCC-44 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | PLASTIC, LCC-44 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
Address bus width | 8 | 8 | 8 | 8 | 8 |
bit size | 8 | 8 | 8 | 8 | 8 |
boundary scan | NO | NO | NO | NO | NO |
maximum clock frequency | 3.2 MHz | 3.2 MHz | 3.2 MHz | 3.2 MHz | 3.2 MHz |
External data bus width | 8 | 8 | 8 | 8 | 8 |
Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
Integrated cache | NO | NO | NO | NO | NO |
JESD-30 code | R-PDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-PDIP-T40 | S-PQCC-J44 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
low power mode | NO | NO | NO | NO | NO |
Number of terminals | 40 | 40 | 40 | 40 | 44 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP | QCCJ |
Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5/10 V | 5/10 V | 5/10 V | 5/10 V | 5/10 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 6.35 mm | 5.72 mm | 5.72 mm | 6.35 mm | 4.57 mm |
speed | 3.2 MHz | 3.2 MHz | 3.2 MHz | 3.2 MHz | 3.2 MHz |
Maximum slew rate | 4 mA | 4 mA | 4 mA | 4 mA | 4 mA |
Maximum supply voltage | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V |
Minimum supply voltage | 4 V | 4 V | 4 V | 4 V | 4 V |
Nominal supply voltage | 10 V | 10 V | 10 V | 10 V | 10 V |
surface mount | NO | NO | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 16.585 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
length | 51.75 mm | - | - | 51.75 mm | 16.585 mm |
Parts packaging code | - | DIP | DIP | - | LCC |
Contacts | - | 40 | 40 | - | 44 |