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CDP1802AE

Description
8-BIT, 3.2MHz, MICROPROCESSOR, PDIP40, PLASTIC, DIP-40
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size116KB,27 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

CDP1802AE Overview

8-BIT, 3.2MHz, MICROPROCESSOR, PDIP40, PLASTIC, DIP-40

CDP1802AE Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
package instructionDIP, DIP40,.6
Reach Compliance Codenot_compliant
Address bus width8
bit size8
boundary scanNO
maximum clock frequency3.2 MHz
External data bus width8
FormatFIXED POINT
Integrated cacheNO
JESD-30 codeR-PDIP-T40
JESD-609 codee0
length51.75 mm
low power modeNO
Number of terminals40
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5/10 V
Certification statusNot Qualified
Maximum seat height6.35 mm
speed3.2 MHz
Maximum slew rate4 mA
Maximum supply voltage6.5 V
Minimum supply voltage4 V
Nominal supply voltage10 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR

CDP1802AE Related Products

CDP1802AE CDP1802AD CDP1802ADX CDP1802AEX CDP1802AQ
Description 8-BIT, 3.2MHz, MICROPROCESSOR, PDIP40, PLASTIC, DIP-40 8-BIT, 3.2MHz, MICROPROCESSOR, CDIP40, SIDE BRAZED, DIP-40 8-BIT, 3.2MHz, MICROPROCESSOR, CDIP40, SIDE BRAZED, DIP-40 8-BIT, 3.2MHz, MICROPROCESSOR, PDIP40, PLASTIC, DIP-40 8-BIT, 3.2MHz, MICROPROCESSOR, PQCC44, PLASTIC, LCC-44
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
package instruction DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 DIP, DIP40,.6 PLASTIC, LCC-44
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant _compli
Address bus width 8 8 8 8 8
bit size 8 8 8 8 8
boundary scan NO NO NO NO NO
maximum clock frequency 3.2 MHz 3.2 MHz 3.2 MHz 3.2 MHz 3.2 MHz
External data bus width 8 8 8 8 8
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache NO NO NO NO NO
JESD-30 code R-PDIP-T40 R-CDIP-T40 R-CDIP-T40 R-PDIP-T40 S-PQCC-J44
JESD-609 code e0 e0 e0 e0 e0
low power mode NO NO NO NO NO
Number of terminals 40 40 40 40 44
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP QCCJ
Encapsulate equivalent code DIP40,.6 DIP40,.6 DIP40,.6 DIP40,.6 LDCC44,.7SQ
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
Package form IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5/10 V 5/10 V 5/10 V 5/10 V 5/10 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 6.35 mm 5.72 mm 5.72 mm 6.35 mm 4.57 mm
speed 3.2 MHz 3.2 MHz 3.2 MHz 3.2 MHz 3.2 MHz
Maximum slew rate 4 mA 4 mA 4 mA 4 mA 4 mA
Maximum supply voltage 6.5 V 6.5 V 6.5 V 6.5 V 6.5 V
Minimum supply voltage 4 V 4 V 4 V 4 V 4 V
Nominal supply voltage 10 V 10 V 10 V 10 V 10 V
surface mount NO NO NO NO YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 15.24 mm 15.24 mm 15.24 mm 16.585 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
length 51.75 mm - - 51.75 mm 16.585 mm
Parts packaging code - DIP DIP - LCC
Contacts - 40 40 - 44

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