IC 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP16, CERAMIC, DIP-16, Analog to Digital Converter
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Is Samacsys | N |
Maximum analog input voltage | 5 V |
Minimum analog input voltage | |
Maximum conversion time | 18 µs |
Converter type | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 code | R-GDIP-T16 |
JESD-609 code | e0 |
length | 19.43 mm |
Maximum linear error (EL) | 0.4% |
Number of analog input channels | 2 |
Number of digits | 8 |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Output bit code | BINARY |
Output format | SERIAL |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum slew rate | 10 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
Base Number Matches | 1 |
ADC0851CIJ | ADC0851BIJ | ADC0851CMJ | ADC0858CIJ | ADC0858BIJ | ADC0858CMJ | |
---|---|---|---|---|---|---|
Description | IC 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP16, CERAMIC, DIP-16, Analog to Digital Converter | IC 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP16, CERAMIC, DIP-16, Analog to Digital Converter | IC 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP16, CERAMIC, DIP-16, Analog to Digital Converter | IC 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP20, CERAMIC, DIP-20, Analog to Digital Converter | IC 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP20, CERAMIC, DIP-20, Analog to Digital Converter | IC 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP20, CERAMIC, DIP-20, Analog to Digital Converter |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | EAR99 | 3A001.A.2.C |
Maximum analog input voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Maximum conversion time | 18 µs | 18 µs | 18 µs | 18 µs | 18 µs | 18 µs |
Converter type | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 code | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T20 | R-GDIP-T20 | R-GDIP-T20 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
length | 19.43 mm | 19.43 mm | 19.43 mm | 24.51 mm | 24.51 mm | 24.51 mm |
Maximum linear error (EL) | 0.4% | 0.2% | 0.4% | 0.4% | 0.2% | 0.4% |
Number of analog input channels | 2 | 2 | 2 | 8 | 8 | 8 |
Number of digits | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 16 | 16 | 16 | 20 | 20 | 20 |
Maximum operating temperature | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C |
Minimum operating temperature | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -55 °C |
Output bit code | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
Output format | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
Maximum slew rate | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |