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M93C56-WMN6TP |
M93C56-RMN6TP |
M93C66-WMN6TP |
M93C86-WMN6TP |
M93C86-WMN6P |
M93C66-WDW6TP |
Description |
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Memory interface type: SPI Memory capacity: 2Kb (256 x 8, 128 x 16) Operating voltage: 1.8V ~ 5.5V Memory type: Non-Volatile |
Memory interface type: SPI Memory capacity: 4Kb (512 x 8, 256 x 16) Operating voltage: 2.5V ~ 5.5V Memory type: Non-Volatile 2.5V-5.5V 4K |
Memory interface type: SPI Memory capacity: 16Kb (2K x 8, 1K x 16) Operating voltage: 2.5V ~ 5.5V Memory type: Non-Volatile 16-KBIT |
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Brand Name |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
Maker |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
Parts packaging code |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
package instruction |
SOP, SOP8,.25 |
SOP, SOP8,.25 |
SOP, SOP8,.25 |
SOP, SOP8,.25 |
SOP, SOP8,.25 |
TSSOP, TSSOP8,.25 |
Contacts |
8 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
13 weeks |
13 weeks |
13 weeks |
13 weeks |
13 weeks |
13 weeks |
Spare memory width |
8 |
8 |
8 |
8 |
8 |
8 |
Maximum clock frequency (fCLK) |
2 MHz |
1 MHz |
2 MHz |
2 MHz |
2 MHz |
2 MHz |
Data retention time - minimum |
40 |
40 |
40 |
40 |
40 |
40 |
Durability |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
JESD-30 code |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609 code |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
length |
4.9 mm |
4.9 mm |
4.9 mm |
4.9 mm |
4.9 mm |
4.4 mm |
memory density |
2048 bit |
2048 bit |
4096 bit |
16384 bit |
16384 bit |
4096 bit |
Memory IC Type |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
memory width |
16 |
16 |
16 |
16 |
16 |
16 |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
word count |
128 words |
128 words |
256 words |
1024 words |
1024 words |
256 words |
character code |
128 |
128 |
256 |
1000 |
1000 |
256 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
organize |
128X16 |
128X16 |
256X16 |
1KX16 |
1KX16 |
256X16 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
SOP |
SOP |
SOP |
SOP |
TSSOP |
Encapsulate equivalent code |
SOP8,.25 |
SOP8,.25 |
SOP8,.25 |
SOP8,.25 |
SOP8,.25 |
TSSOP8,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
power supply |
3/5 V |
2/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.75 mm |
1.75 mm |
1.75 mm |
1.75 mm |
1.75 mm |
1.2 mm |
Serial bus type |
MICROWIRE |
MICROWIRE |
MICROWIRE |
MICROWIRE |
MICROWIRE |
MICROWIRE |
Maximum standby current |
0.000005 A |
0.000002 A |
0.000005 A |
0.00001 A |
0.00001 A |
0.00001 A |
Maximum slew rate |
0.002 mA |
0.002 mA |
0.002 mA |
0.001 mA |
0.001 mA |
0.0015 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
2.5 V |
1.8 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
30 |
30 |
30 |
30 |
width |
3.9 mm |
3.9 mm |
3.9 mm |
3.9 mm |
3.9 mm |
3 mm |
Maximum write cycle time (tWC) |
5 ms |
10 ms |
5 ms |
5 ms |
5 ms |
5 ms |
write protect |
SOFTWARE |
SOFTWARE |
SOFTWARE |
SOFTWARE |
SOFTWARE |
SOFTWARE |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
- |