Memory interface type: SPI Memory capacity: 4Kb (512 x 8, 256 x 16) Operating voltage: 2.5V ~ 5.5V Memory type: Non-Volatile 2.5V-5.5V 4K
| Parameter Name | Attribute value |
| Brand Name | STMicroelectronics |
| Maker | STMicroelectronics |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP8,.25 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Factory Lead Time | 13 weeks |
| Samacsys Description | M93C66-WMN6TP, Serial EEPROM Memory 4kbit, Serial-Microwire, 200ns 2.5 → 5.5 V, 8-Pin SOIC |
| Spare memory width | 8 |
| Maximum clock frequency (fCLK) | 2 MHz |
| Data retention time - minimum | 40 |
| Durability | 1000000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e4 |
| length | 4.9 mm |
| memory density | 4096 bit |
| Memory IC Type | EEPROM |
| memory width | 16 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 256 words |
| character code | 256 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256X16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.75 mm |
| Serial bus type | MICROWIRE |
| Maximum standby current | 0.000005 A |
| Maximum slew rate | 0.002 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 3.9 mm |
| Maximum write cycle time (tWC) | 5 ms |
| write protect | SOFTWARE |
| Base Number Matches | 1 |
| M93C66-WMN6TP | M93C56-RMN6TP | M93C56-WMN6TP | M93C86-WMN6TP | M93C86-WMN6P | M93C66-WDW6TP | |
|---|---|---|---|---|---|---|
| Description | Memory interface type: SPI Memory capacity: 4Kb (512 x 8, 256 x 16) Operating voltage: 2.5V ~ 5.5V Memory type: Non-Volatile 2.5V-5.5V 4K | Memory interface type: SPI Memory capacity: 2Kb (256 x 8, 128 x 16) Operating voltage: 1.8V ~ 5.5V Memory type: Non-Volatile | Memory interface type: SPI Memory capacity: 16Kb (2K x 8, 1K x 16) Operating voltage: 2.5V ~ 5.5V Memory type: Non-Volatile 16-KBIT | |||
| Brand Name | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Parts packaging code | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| package instruction | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 13 weeks | 13 weeks | 13 weeks | 13 weeks | 13 weeks | 13 weeks |
| Spare memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum clock frequency (fCLK) | 2 MHz | 1 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
| Data retention time - minimum | 40 | 40 | 40 | 40 | 40 | 40 |
| Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e4 | e4 | e4 | e4 | e4 | e4 |
| length | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.4 mm |
| memory density | 4096 bit | 2048 bit | 2048 bit | 16384 bit | 16384 bit | 4096 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 16 | 16 | 16 | 16 | 16 | 16 |
| Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 256 words | 128 words | 128 words | 1024 words | 1024 words | 256 words |
| character code | 256 | 128 | 128 | 1000 | 1000 | 256 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 256X16 | 128X16 | 128X16 | 1KX16 | 1KX16 | 256X16 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP | SOP | SOP | TSSOP |
| Encapsulate equivalent code | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | TSSOP8,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
| power supply | 3/5 V | 2/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.2 mm |
| Serial bus type | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| Maximum standby current | 0.000005 A | 0.000002 A | 0.000005 A | 0.00001 A | 0.00001 A | 0.00001 A |
| Maximum slew rate | 0.002 mA | 0.002 mA | 0.002 mA | 0.001 mA | 0.001 mA | 0.0015 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2.5 V | 1.8 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 |
| width | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3 mm |
| Maximum write cycle time (tWC) | 5 ms | 10 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| write protect | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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