M93C86-WMN6P datasheet, PDF - EEWORLD Datasheet

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M93C86-WMN6P: Categorystorage storage; File Size436KB，35 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M93C86-WMN6P Parametric

Parameter Name	Attribute value
Brand Name	STMicroelectronics
Maker	STMicroelectronics
Parts packaging code	SOIC
package instruction	SOP, SOP8,.25
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	13 weeks
Samacsys Description	M93C86-WMN6P, Serial EEPROM Memory 16kbit, Serial-Microwire, 200ns 2.5 → 5.5 V, 8-Pin
Spare memory width	8
Maximum clock frequency (fCLK)	2 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
JESD-609 code	e4
length	4.9 mm
memory density	16384 bit
Memory IC Type	EEPROM
memory width	16
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
word count	1024 words
character code	1000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1KX16
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	1.75 mm
Serial bus type	MICROWIRE
Maximum standby current	0.00001 A
Maximum slew rate	0.001 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3.9 mm
Maximum write cycle time (tWC)	5 ms
write protect	SOFTWARE
Base Number Matches	1

M93C86-WMN6P Related Products

	M93C86-WMN6P	M93C56-RMN6TP	M93C66-WMN6TP	M93C56-WMN6TP	M93C86-WMN6TP	M93C66-WDW6TP
Description		Memory interface type: SPI Memory capacity: 2Kb (256 x 8, 128 x 16) Operating voltage: 1.8V ~ 5.5V Memory type: Non-Volatile	Memory interface type: SPI Memory capacity: 4Kb (512 x 8, 256 x 16) Operating voltage: 2.5V ~ 5.5V Memory type: Non-Volatile 2.5V-5.5V 4K		Memory interface type: SPI Memory capacity: 16Kb (2K x 8, 1K x 16) Operating voltage: 2.5V ~ 5.5V Memory type: Non-Volatile 16-KBIT
Brand Name	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC
package instruction	SOP, SOP8,.25	SOP, SOP8,.25	SOP, SOP8,.25	SOP, SOP8,.25	SOP, SOP8,.25	TSSOP, TSSOP8,.25
Contacts	8	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Factory Lead Time	13 weeks	13 weeks	13 weeks	13 weeks	13 weeks	13 weeks
Spare memory width	8	8	8	8	8	8
Maximum clock frequency (fCLK)	2 MHz	1 MHz	2 MHz	2 MHz	2 MHz	2 MHz
Data retention time - minimum	40	40	40	40	40	40
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e4	e4	e4	e4	e4	e4
length	4.9 mm	4.9 mm	4.9 mm	4.9 mm	4.9 mm	4.4 mm
memory density	16384 bit	2048 bit	4096 bit	2048 bit	16384 bit	4096 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	16	16	16	16	16	16
Humidity sensitivity level	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8
word count	1024 words	128 words	256 words	128 words	1024 words	256 words
character code	1000	128	256	128	1000	256
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	1KX16	128X16	256X16	128X16	1KX16	256X16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	SOP	SOP	SOP	TSSOP
Encapsulate equivalent code	SOP8,.25	SOP8,.25	SOP8,.25	SOP8,.25	SOP8,.25	TSSOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260
power supply	3/5 V	2/5 V	3/5 V	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.75 mm	1.75 mm	1.75 mm	1.75 mm	1.75 mm	1.2 mm
Serial bus type	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE
Maximum standby current	0.00001 A	0.000002 A	0.000005 A	0.000005 A	0.00001 A	0.00001 A
Maximum slew rate	0.001 mA	0.002 mA	0.002 mA	0.002 mA	0.001 mA	0.0015 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.5 V	1.8 V	2.5 V	2.5 V	2.5 V	2.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30
width	3.9 mm	3.9 mm	3.9 mm	3.9 mm	3.9 mm	3 mm
Maximum write cycle time (tWC)	5 ms	10 ms	5 ms	5 ms	5 ms	5 ms
write protect	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE
Base Number Matches	1	1	1	1	1	-

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