LTC4304CMS#PBF datasheet, PDF - EEWORLD Datasheet

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LTC4304CMS#PBF: DescriptionIC ACCELERATR I2C HOTSWAP 10MSOP; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size620KB，16 Pages; ManufacturerLinear ( ADI ); Websitehttp://www.analog.com/cn/index.html; Environmental Compliance

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LTC4304CMS#PBF Overview

IC ACCELERATR I2C HOTSWAP 10MSOP

LTC4304CMS#PBF Parametric

Parameter Name	Attribute value
Brand Name	Linear Technology
Is it Rohs certified?	conform to
Maker	Linear ( ADI )
Parts packaging code	MSOP
package instruction	TSSOP, TSSOP10,.19,20
Contacts	10
Manufacturer packaging code	MS
Reach Compliance Code	compliant
ECCN code	EAR99
Interface integrated circuit type	INTERFACE CIRCUIT
JESD-30 code	S-PDSO-G10
JESD-609 code	e3
length	3 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	10
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP10,.19,20
Package shape	SQUARE
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	1.1 mm
Maximum slew rate	8 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	2.7 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3 mm

LTC4304CMS#PBF Related Products

	LTC4304CMS#PBF	LTC4304CDD#PBF	LTC4304IMS#PBF	LTC4304IDD#PBF	LTC4304CDD#TRPBF	LTC4304CMS#TRPBF	LTC4304IMS#TRPBF	LTC4304IDD#TRPBF
Description	IC ACCELERATR I2C HOTSWAP 10MSOP	IC ACCELERATOR I2C HOTSWAP 10DFN	IC ACCELERATR I2C HOTSWAP 10MSOP	IC ACCELERATOR I2C HOTSWAP 10DFN	IC ACCELERATOR I2C HOTSWAP 10DFN	IC ACCELERATR I2C HOTSWAP 10MSOP	IC ACCELERATR I2C HOTSWAP 10MSOP	IC ACCELERATOR I2C HOTSWAP 10DFN
Brand Name	Linear Technology	Linear Technology	Linear Technology	Linear Technology	Linear Technology	Linear Technology	Linear Technology	Linear Technology
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )	Linear ( ADI )
Parts packaging code	MSOP	DFN	MSOP	DFN	DFN	MSOP	MSOP	DFN
package instruction	TSSOP, TSSOP10,.19,20	HVSON, SOLCC10,.12,20	TSSOP, TSSOP10,.19,20	HVSON, SOLCC10,.12,20	HVSON, SOLCC10,.12,20	TSSOP, TSSOP10,.19,20	TSSOP, TSSOP10,.19,20	HVSON, SOLCC10,.12,20
Contacts	10	10	10	10	10	10	10	10
Manufacturer packaging code	MS	DD	MS	DD	DD	MS	MS	DD
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Interface integrated circuit type	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT
JESD-30 code	S-PDSO-G10	S-PDSO-N10	S-PDSO-G10	S-PDSO-N10	S-PDSO-N10	S-PDSO-G10	S-PDSO-G10	S-PDSO-N10
JESD-609 code	e3	e3	e3	e3	e3	e3	e3	e3
length	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm
Humidity sensitivity level	1	1	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	10	10	10	10	10	10	10	10
Maximum operating temperature	70 °C	70 °C	85 °C	85 °C	70 °C	70 °C	85 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	HVSON	TSSOP	HVSON	HVSON	TSSOP	TSSOP	HVSON
Encapsulate equivalent code	TSSOP10,.19,20	SOLCC10,.12,20	TSSOP10,.19,20	SOLCC10,.12,20	SOLCC10,.12,20	TSSOP10,.19,20	TSSOP10,.19,20	SOLCC10,.12,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260
power supply	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.1 mm	0.8 mm	1.1 mm	0.8 mm	0.8 mm	1.1 mm	1.1 mm	0.8 mm
Maximum slew rate	8 mA	8 mA	8 mA	8 mA	8 mA	8 mA	8 mA	8 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	GULL WING	NO LEAD	GULL WING	NO LEAD	NO LEAD	GULL WING	GULL WING	NO LEAD
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30	30	30
width	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm	3 mm

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