EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

LTC4304IDD#PBF

Description
IC ACCELERATOR I2C HOTSWAP 10DFN
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size620KB,16 Pages
ManufacturerLinear ( ADI )
Websitehttp://www.analog.com/cn/index.html
Environmental Compliance
Download Datasheet Parametric Compare View All

LTC4304IDD#PBF Overview

IC ACCELERATOR I2C HOTSWAP 10DFN

LTC4304IDD#PBF Parametric

Parameter NameAttribute value
Brand NameLinear Technology
Is it Rohs certified?conform to
MakerLinear ( ADI )
Parts packaging codeDFN
package instructionHVSON, SOLCC10,.12,20
Contacts10
Manufacturer packaging codeDD
Reach Compliance Codecompliant
ECCN codeEAR99
Interface integrated circuit typeINTERFACE CIRCUIT
JESD-30 codeS-PDSO-N10
JESD-609 codee3
length3 mm
Humidity sensitivity level1
Number of functions1
Number of terminals10
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHVSON
Encapsulate equivalent codeSOLCC10,.12,20
Package shapeSQUARE
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
power supply3/5 V
Certification statusNot Qualified
Maximum seat height0.8 mm
Maximum slew rate8 mA
Maximum supply voltage5.5 V
Minimum supply voltage2.7 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3 mm

LTC4304IDD#PBF Related Products

LTC4304IDD#PBF LTC4304CDD#PBF LTC4304IMS#PBF LTC4304CDD#TRPBF LTC4304CMS#TRPBF LTC4304IMS#TRPBF LTC4304IDD#TRPBF LTC4304CMS#PBF
Description IC ACCELERATOR I2C HOTSWAP 10DFN IC ACCELERATOR I2C HOTSWAP 10DFN IC ACCELERATR I2C HOTSWAP 10MSOP IC ACCELERATOR I2C HOTSWAP 10DFN IC ACCELERATR I2C HOTSWAP 10MSOP IC ACCELERATR I2C HOTSWAP 10MSOP IC ACCELERATOR I2C HOTSWAP 10DFN IC ACCELERATR I2C HOTSWAP 10MSOP
Brand Name Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Maker Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI )
Parts packaging code DFN DFN MSOP DFN MSOP MSOP DFN MSOP
package instruction HVSON, SOLCC10,.12,20 HVSON, SOLCC10,.12,20 TSSOP, TSSOP10,.19,20 HVSON, SOLCC10,.12,20 TSSOP, TSSOP10,.19,20 TSSOP, TSSOP10,.19,20 HVSON, SOLCC10,.12,20 TSSOP, TSSOP10,.19,20
Contacts 10 10 10 10 10 10 10 10
Manufacturer packaging code DD DD MS DD MS MS DD MS
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Interface integrated circuit type INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 code S-PDSO-N10 S-PDSO-N10 S-PDSO-G10 S-PDSO-N10 S-PDSO-G10 S-PDSO-G10 S-PDSO-N10 S-PDSO-G10
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3
length 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
Humidity sensitivity level 1 1 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 10 10 10 10 10 10 10 10
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 70 °C 85 °C 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVSON HVSON TSSOP HVSON TSSOP TSSOP HVSON TSSOP
Encapsulate equivalent code SOLCC10,.12,20 SOLCC10,.12,20 TSSOP10,.19,20 SOLCC10,.12,20 TSSOP10,.19,20 TSSOP10,.19,20 SOLCC10,.12,20 TSSOP10,.19,20
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260
power supply 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 0.8 mm 0.8 mm 1.1 mm 0.8 mm 1.1 mm 1.1 mm 0.8 mm 1.1 mm
Maximum slew rate 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form NO LEAD NO LEAD GULL WING NO LEAD GULL WING GULL WING NO LEAD GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30 30 30 30
width 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号