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LTC4304IMS#PBF

Description
IC ACCELERATR I2C HOTSWAP 10MSOP
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size620KB,16 Pages
ManufacturerLinear ( ADI )
Websitehttp://www.analog.com/cn/index.html
Environmental Compliance
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LTC4304IMS#PBF Overview

IC ACCELERATR I2C HOTSWAP 10MSOP

LTC4304IMS#PBF Parametric

Parameter NameAttribute value
Brand NameLinear Technology
Is it Rohs certified?conform to
MakerLinear ( ADI )
Parts packaging codeMSOP
package instructionTSSOP, TSSOP10,.19,20
Contacts10
Manufacturer packaging codeMS
Reach Compliance Codecompliant
ECCN codeEAR99
Interface integrated circuit typeINTERFACE CIRCUIT
JESD-30 codeS-PDSO-G10
JESD-609 codee3
length3 mm
Humidity sensitivity level1
Number of functions1
Number of terminals10
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP10,.19,20
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
power supply3/5 V
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum slew rate8 mA
Maximum supply voltage5.5 V
Minimum supply voltage2.7 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3 mm

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Description IC ACCELERATR I2C HOTSWAP 10MSOP IC ACCELERATOR I2C HOTSWAP 10DFN IC ACCELERATOR I2C HOTSWAP 10DFN IC ACCELERATOR I2C HOTSWAP 10DFN IC ACCELERATR I2C HOTSWAP 10MSOP IC ACCELERATR I2C HOTSWAP 10MSOP IC ACCELERATOR I2C HOTSWAP 10DFN IC ACCELERATR I2C HOTSWAP 10MSOP
Brand Name Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Maker Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI )
Parts packaging code MSOP DFN DFN DFN MSOP MSOP DFN MSOP
package instruction TSSOP, TSSOP10,.19,20 HVSON, SOLCC10,.12,20 HVSON, SOLCC10,.12,20 HVSON, SOLCC10,.12,20 TSSOP, TSSOP10,.19,20 TSSOP, TSSOP10,.19,20 HVSON, SOLCC10,.12,20 TSSOP, TSSOP10,.19,20
Contacts 10 10 10 10 10 10 10 10
Manufacturer packaging code MS DD DD DD MS MS DD MS
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Interface integrated circuit type INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 code S-PDSO-G10 S-PDSO-N10 S-PDSO-N10 S-PDSO-N10 S-PDSO-G10 S-PDSO-G10 S-PDSO-N10 S-PDSO-G10
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3
length 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
Humidity sensitivity level 1 1 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 10 10 10 10 10 10 10 10
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 70 °C 85 °C 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP HVSON HVSON HVSON TSSOP TSSOP HVSON TSSOP
Encapsulate equivalent code TSSOP10,.19,20 SOLCC10,.12,20 SOLCC10,.12,20 SOLCC10,.12,20 TSSOP10,.19,20 TSSOP10,.19,20 SOLCC10,.12,20 TSSOP10,.19,20
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260
power supply 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.1 mm 0.8 mm 0.8 mm 0.8 mm 1.1 mm 1.1 mm 0.8 mm 1.1 mm
Maximum slew rate 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING NO LEAD NO LEAD NO LEAD GULL WING GULL WING NO LEAD GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30 30 30 30
width 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm

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