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74AXP1T34GWH

Description
IC TRNSLTR UNIDIRECTIONAL 5TSSOP
Categorylogic    logic   
File Size828KB,21 Pages
ManufacturerNexperia
Websitehttps://www.nexperia.com
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IC TRNSLTR UNIDIRECTIONAL 5TSSOP

74AXP1T34GWH Parametric

Parameter NameAttribute value
Brand NameNexperia
MakerNexperia
Parts packaging codeTSSOP
package instructionTSSOP,
Contacts5
Manufacturer packaging codeSOT353-1
Reach Compliance Codecompliant
Samacsys DescriptionNEXPERIA - 74AXP1T34GWH - TRANSLATING BUFFER, 1-CH, TSSOP-5
seriesAXP
JESD-30 codeR-PDSO-G5
length2.05 mm
Logic integrated circuit typeBUFFER
Number of functions1
Number of entries1
Number of terminals5
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
propagation delay (tpd)210 ns
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)2.75 V
Minimum supply voltage (Vsup)0.7 V
Nominal supply voltage (Vsup)1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width1.25 mm

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74AXP1T34GWH 74AXP1T34GXH 74AXP1T34GSH 74AXP1T34GNH 74AXP1T34GMH
Description IC TRNSLTR UNIDIRECTIONAL 5TSSOP IC TRNSLTR UNIDIRECTIONAL 5X2SON IC TRNSLTR UNIDIRECTIONAL 6XSON IC TRNSLTR UNIDIRECTIONAL 6XSON IC TRNSLTR UNIDIRECTIONAL 6XSON
Brand Name Nexperia Nexperia Nexperia Nexperia Nexperia
Maker Nexperia Nexperia Nexperia Nexperia Nexperia
package instruction TSSOP, HVBCC, VSON, SON, VSON,
Manufacturer packaging code SOT353-1 SOT1226 SOT1202 SOT1115 SOT886
Reach Compliance Code compliant compliant compliant compliant compliant
series AXP AXP AXP AXP AXP
JESD-30 code R-PDSO-G5 S-PBCC-B5 S-PDSO-N6 R-PDSO-N6 R-PDSO-N6
length 2.05 mm 0.8 mm 1 mm 1 mm 1.45 mm
Logic integrated circuit type BUFFER BUFFER BUFFER BUFFER BUFFER
Number of functions 1 1 1 1 1
Number of entries 1 1 1 1 1
Number of terminals 5 5 6 6 6
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP HVBCC VSON SON VSON
Package shape RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
propagation delay (tpd) 210 ns 210 ns 210 ns 210 ns 210 ns
Maximum seat height 1.1 mm 0.35 mm 0.35 mm 0.35 mm 0.5 mm
Maximum supply voltage (Vsup) 2.75 V 2.75 V 2.75 V 2.75 V 2.75 V
Minimum supply voltage (Vsup) 0.7 V 0.7 V 0.7 V 0.7 V 0.7 V
Nominal supply voltage (Vsup) 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING BUTT NO LEAD NO LEAD NO LEAD
Terminal location DUAL BOTTOM DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 1.25 mm 0.8 mm 1 mm 0.9 mm 1 mm
Parts packaging code TSSOP SON - SON SON
Contacts 5 5 - 6 6
Samacsys Description NEXPERIA - 74AXP1T34GWH - TRANSLATING BUFFER, 1-CH, TSSOP-5 - 74AXP1T34 - Dual supply translating buffer@en-us 74AXP1T34 - Dual supply translating buffer@en-us 74AXP1T34 - Dual supply translating buffer@en-us
Terminal pitch 0.65 mm - 0.35 mm 0.3 mm 0.5 mm
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