74AXP1T34GXH datasheet, PDF - EEWORLD Datasheet

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74AXP1T34GXH: DescriptionIC TRNSLTR UNIDIRECTIONAL 5X2SON; Categorylogic logic; File Size828KB，21 Pages; ManufacturerNexperia; Websitehttps://www.nexperia.com

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74AXP1T34GXH Overview

IC TRNSLTR UNIDIRECTIONAL 5X2SON

74AXP1T34GXH Parametric

Parameter Name	Attribute value
Brand Name	Nexperia
Maker	Nexperia
Parts packaging code	SON
package instruction	HVBCC,
Contacts	5
Manufacturer packaging code	SOT1226
Reach Compliance Code	compliant
Factory Lead Time	13 weeks
series	AXP
JESD-30 code	S-PBCC-B5
length	0.8 mm
Logic integrated circuit type	BUFFER
Number of functions	1
Number of entries	1
Number of terminals	5
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	HVBCC
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
propagation delay (tpd)	210 ns
Maximum seat height	0.35 mm
Maximum supply voltage (Vsup)	2.75 V
Minimum supply voltage (Vsup)	0.7 V
Nominal supply voltage (Vsup)	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BUTT
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	0.8 mm

74AXP1T34GXH Related Products

	74AXP1T34GXH	74AXP1T34GSH	74AXP1T34GNH	74AXP1T34GMH	74AXP1T34GWH
Description	IC TRNSLTR UNIDIRECTIONAL 5X2SON	IC TRNSLTR UNIDIRECTIONAL 6XSON	IC TRNSLTR UNIDIRECTIONAL 6XSON	IC TRNSLTR UNIDIRECTIONAL 6XSON	IC TRNSLTR UNIDIRECTIONAL 5TSSOP
Brand Name	Nexperia	Nexperia	Nexperia	Nexperia	Nexperia
Maker	Nexperia	Nexperia	Nexperia	Nexperia	Nexperia
package instruction	HVBCC,	VSON,	SON,	VSON,	TSSOP,
Manufacturer packaging code	SOT1226	SOT1202	SOT1115	SOT886	SOT353-1
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
series	AXP	AXP	AXP	AXP	AXP
JESD-30 code	S-PBCC-B5	S-PDSO-N6	R-PDSO-N6	R-PDSO-N6	R-PDSO-G5
length	0.8 mm	1 mm	1 mm	1.45 mm	2.05 mm
Logic integrated circuit type	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER
Number of functions	1	1	1	1	1
Number of entries	1	1	1	1	1
Number of terminals	5	6	6	6	5
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVBCC	VSON	SON	VSON	TSSOP
Package shape	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
propagation delay (tpd)	210 ns	210 ns	210 ns	210 ns	210 ns
Maximum seat height	0.35 mm	0.35 mm	0.35 mm	0.5 mm	1.1 mm
Maximum supply voltage (Vsup)	2.75 V	2.75 V	2.75 V	2.75 V	2.75 V
Minimum supply voltage (Vsup)	0.7 V	0.7 V	0.7 V	0.7 V	0.7 V
Nominal supply voltage (Vsup)	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BUTT	NO LEAD	NO LEAD	NO LEAD	GULL WING
Terminal location	BOTTOM	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	0.8 mm	1 mm	0.9 mm	1 mm	1.25 mm
Parts packaging code	SON	-	SON	SON	TSSOP
Contacts	5	-	6	6	5
Samacsys Description	-	74AXP1T34 - Dual supply translating buffer@en-us	74AXP1T34 - Dual supply translating buffer@en-us	74AXP1T34 - Dual supply translating buffer@en-us	NEXPERIA - 74AXP1T34GWH - TRANSLATING BUFFER, 1-CH, TSSOP-5
Terminal pitch	-	0.35 mm	0.3 mm	0.5 mm	0.65 mm

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