A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
[i=s]This post was last edited by littleshrimp on 2021-3-5 11:57[/i]MLX90614 is a high-precision infrared temperature sensor. The MLX90614XXX-BCF has a field of view of 10 degrees. It integrates ADC a...
Hello everyone, I recently encountered an impedance matching problem about ultrasonic transducers. The equivalent circuit of the ultrasonic transducer is shown in Figure 1.Figure 1 Equivalent model of...
The outermost UUID is called service (serverID) for the time being, and the next layer is called characteristic (characteristicID) for the time being. The characteristic layer can be used to encapsula...
At first, UWB and Bluetooth may sound very similar. Bluetooth Low Energy (BLE) is a low-power radio system that has been used in beacons for ranging and measuring location, or at least that’s the prom...
[i=s]This post was last edited by Baboerben on 2020-6-11 21:17[/i]When learning MSP430, I transplanted the commonly used modules I learned before. Since MSP430F149 does not have an IIC interface, I si...
The National Aeronautics and Space Administration (NASA) announced at the 2018 Geophysical Meeting in the United States that by comparing the data sent back by different instruments on Voyager 2, afte...
Go to A2.3 Registers in the ARM Architecture Reference Manual
R13 is usually used as SP stack pointer in the program! !
R14 is usually used as LR (link register) in the progra...[Details]
Allegro's giant magnetoresistance (GMR) crankshaft and camshaft sensors ATS16951 (crankshaft) and ATS16351 (camshaft) for full and mild hybrid engine designs can provide manufacturers with a single...[Details]
Fundraising shrunk by 800 million yuan, the "speed of life and death" in the intelligent driving circle
Recently, there has been another big news in the field of intelligent driving: anoth...[Details]
P3 released the Autonomous Driving Market Insight, which is divided into three parts: Maas, cargo transportation and personal ownership. This article is the first part, which focuses on Maas and is...[Details]
Production technology requirements
1) In principle, the production area of automobile airbag harnesses should be a dust-free, clean, independent closed workshop, and the temperature and humi...[Details]
Audio/Voice User Interface (VUI) is an important emerging trend in future human-computer interaction. It will be increasingly used in vertical fields of IoT such as smart home control, building aut...[Details]
01 Overall development and breakthroughs in information security of intelligent connected cars With the centralized evolution of vehicle electronic and electrical architecture, the...[Details]
Picocci’s PC802 SoC and 5G NR software selected by Contela as core components for its distributed unit and radio frequency unit Beijing, China, August 9, 2023 - Picocom, a provider of 5G open RA...[Details]
Composition of air conditioning refrigeration system
The air conditioning and refrigeration system generally consists of the following main components:
1. Compressor: The compressor is th...[Details]
New water policy for enterprises: water-saving transformation and green transformation
Some time ago, Guangzhou held a hearing on tap water prices, at which a plan ...[Details]
Hangzhou Colin Electric Co., Ltd. (hereinafter referred to as the "Company") intends to use its wholly-owned subsidiary Hangzhou Colin New Energy Co., Ltd. (hereinafter referred to as "Colin New En...[Details]
As the ballast stone for protecting the high-quality development of energy, the new energy storage industry has ushered in a new trend under the background of dual carbon, and many cities are competin...[Details]
What is a high voltage inverter?
A high-voltage inverter is an electrical device that converts industrial frequency power into an adjustable frequency and adjustable amplitude high-voltage pow...[Details]
Sensor
京公网安备 11010802033920号
EEWORLD
