Ceramic Plate Series CP10-63-06
Thermoelectric Modules
The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is
considered ‘the standard’ in the thermoelectric industry.
This broad product line of high-performance and highly reliable TEMs is
available in numerous heat pumping capacities, geometric shapes, and
input power ranges. Assembled with Bismuth Telluride semiconductor
material and thermally conductive Aluminum Oxide ceramics, the CP
Series is designed for higher current and large heat-pumping
applications.
Americas: +1.919.597.7300
Europe: +46.31.420530
Asia: +86.755.2714.1166
ets.sales@lairdtech.com
www.lairdtech.com
FEATURES
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Precise temperature control
Compact geometric sizes
Reliable solid state operation
No sound or vibration
Environmentally friendly
DC Operation
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RoHS compliant
APPLICATIONS
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Medical lasers
Lab science instrumentation
Clinical diagnostic systems
Photonics laser systems
Electronic enclosure cooling
Food & beverage cooling
Chillers (liquid cooling)
PERFORMANCE SPECIFICATIONS
Hot Side Temperature (°C)
Qmax (Watts)
Delta Tmax (°C)
Imax (Amps)
Vmax (Volts)
Module Resistance (Ohms)
25°C
13.4
67
3.0
6.8
2.05
50°C
14.9
75
3.0
7.7
2.32
SUFFIX
L
L1
L2
ML
LM
MM
THICKNESS
(PRIOR TO TINNING))
0.141”± 0.010”
0.141”± 0.001”
0.141”± 0.0005”
0.145”± 0.010”
0.145”± 0.010”
0.149”± 0.010”
FLATNESS &
PARALLELISM
0.0015” / 0.0015”
0.001” / 0.001”
0.0005” / 0.0005”
0.002” / 0.002”
0.002” / 0.002”
0.002” / 0.002”
HOT
FACE
Lapped
Lapped
Lapped
Metallized
Lapped
Metallized
COLD
FACE
Lapped
Lapped
Lapped
Lapped
Metallized
Metallized
4.5”
4.5”
4.5”
4.5”
4.5”
4.5”
LEAD
LENGTH
SEALING OPTION
SUFFIX
RT
EP
RTV
Epoxy
SEALANT
COLOR
White
Black
TEMP RANGE
-60 to 204°C
-55 to 150°C
DESCRIPTION
Non-corrosive, silicone adhesive sealant
Low density syntactic foam epoxy encapsulant
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CP10-63-06
Performance Curves at Th = 25°C
THERMO
ELECTRIC
MOUNTING HOLE LOCATION & HARDWARE
Ceramic Material: Alumina (AI
2
O
3
)
Solder Construction: 138°C, Bismuth Tin (BiSn)
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OPERATING TIPS
Max Operating Temperature: 80°C
Do not exceed Imax or Vmax when operating module
Reference assembly guidelines for recommended installation
Solder tinning also available on metallized ceramics
LAIRD-ETS-CP10-63-06-DATA-SHEET-100616
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to
change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies
makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any
specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies
products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished
upon request. © Copyright 2016 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other
marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may
be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights
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ST - Low Power RF
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