I5216PYI datasheet, PDF - EEWORLD Datasheet

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I5216PYI: DescriptionSpeech Synthesizer With RCDG, 960s, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28; CategoryConsumption circuit; File Size670KB，75 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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I5216PYI Overview

Speech Synthesizer With RCDG, 960s, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28

I5216PYI Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknown
Is Samacsys	N
application	CAR STEREO; HANDSET; TRANSFORMER
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDIP-T28
length	36.83 mm
Number of functions	1
Number of terminals	28
On-chip memory type	FLASH
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum read time	960 s
Maximum seat height	4.83 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
surface mount	NO
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

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ISD5216

8 to 16 minutes

voice record/playback device

with integrated codec

-1-

Publication Release Date: Jan. 31, 2006

Revision B.4

ISD5216

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION ......................................................................................................... 2

2. FEATURES ................................................................................................................................. 2

3. BLOCK DIAGRAM ...................................................................................................................... 3

4. TABLE OF CONTENTS .............................................................................................................. 4

5. PIN CONFIGURATION ............................................................................................................... 7

6. PIN DESCRIPTION..................................................................................................................... 8

7. FUNCTIONAL DESCRIPTION.................................................................................................... 9

7.1. MEMORY ORGANIZATION............................................................................................... 11

7.2. CODEC............................................................................................................................... 11

7.2.1. Analog Input to Digital Output Path .......................................................................... 12

7.2.2. Digital Input to Analog Output Path .......................................................................... 13

7.2.3. CODEC External Clock Configuration ...................................................................... 13

7.2.4. ChipCorder Analog Array Sampling Frequency With External Clock....................... 14

7.3. I

C INTERFACE ................................................................................................................. 15

7.3.1. System configuration ................................................................................................ 15

7.3.2. Start and stop conditions .......................................................................................... 15

7.3.3. Bit transfer................................................................................................................. 16

7.3.4. ACKNOWLEDGE ..................................................................................................... 16

7.3.5. Additional ISD5216 flow control................................................................................ 17

7.3.6. I

C Protocol Addressing............................................................................................ 17

7.3.7. I

C Slave Address..................................................................................................... 19

7.4. I2S SERIAL INTERFACE................................................................................................... 20

7.4.1. Serial Data ................................................................................................................ 20

7.4.2. Word Select .............................................................................................................. 21

7.4.3. Timing ....................................................................................................................... 21

7.5. CONTROL REGISTERS .................................................................................................... 22

7.5.1. Command Byte ......................................................................................................... 22

7.5.2. Function Bits ............................................................................................................. 23

7.5.3. Register Bits.............................................................................................................. 23

7.5.4. OPCODE Command Byte Table .............................................................................. 24

7.5.5. Power-up................................................................................................................... 25

7.5.6. Read Status .............................................................................................................. 25

7.5.7. Attaching an Address to a Command....................................................................... 25

7.5.8. Playback Mode ......................................................................................................... 26

7.5.9. Record Mode ............................................................................................................ 26

-4-

ISD5216

7.5.10. Message Cueing..................................................................................................... 26

7.6. digital mode ........................................................................................................................ 26

7.6.1. Writing Data .............................................................................................................. 26

7.6.2. Reading Data ............................................................................................................26

7.6.3. Erasing Data ............................................................................................................. 27

7.6.4. Load Configuration Registers ................................................................................... 27

7.7. ISD5216 ANALOG STRUCTURE (Left Half) description .................................................. 31

7.7.1 Speaker, AUX OUT and Volume Control Description ............................................... 33

7.7.2. Microphone and Auxiliary Inputs .............................................................................. 34

7.7.3. CODEC Configuration (First Page) .......................................................................... 35

7.8. PIN DETAILS...................................................................................................................... 37

7.8.1. Power and Ground Pins............................................................................................ 37

7.8.2. Digital I/O Pins: ......................................................................................................... 37

7.8.3. CODEC Iinterface Pincs ........................................................................................... 39

7.8.4. ANALOG I/O PINS.................................................................................................... 39

7.9. AUTO MUTE AND AUTO GAIN FUNCTIONS .................................................................. 41

7.10 PROGRAMMING THE ISD 5216 ...................................................................................... 41

7.10 PROGRAMMING THE ISD 5216 ...................................................................................... 42

7.10.1. Sending a byte on the I2C interface ....................................................................... 42

7.10.2. POWER-UP SEQUENCE....................................................................................... 42

7.10.3. Read Status command ........................................................................................... 42

7.10.4. Load Command Byte Register (Single Byte Load):................................................ 43

7.10.5. Load Command Byte Register (Address Load):..................................................... 43

7.10.6. Digital Erase............................................................................................................ 44

7.10.7. Digital Write............................................................................................................. 45

7.10.8. Digital Read ............................................................................................................ 45

7.10.9. Feed Through Mode ............................................................................................... 45

7.10.10. Call Record ...........................................................................................................48

7.10.11. Memo Record ....................................................................................................... 49

7.10.12. Memo and Call Playback ...................................................................................... 50

7.11. SAMPLE PC LAYOUT FOR PDIP ................................................................................... 51

8. TIMING DIAGRAMS.................................................................................................................. 52

9. ABSOLUTE MAXIMUM RATINGS............................................................................................ 60

10. ELECTRICAL CHARACTERISTICS....................................................................................... 61

11. TYPICAL APPLICATION CIRCUIT......................................................................................... 67

-5-

Publication Release Date: Jan. 31, 2006

Revision B.4

I5216PYI Related Products

	I5216PYI	I5216EYI	I5216EY	I5216PI	I5216PY	I5216SYI	I5216SY
Description	Speech Synthesizer With RCDG, 960s, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28	Speech Synthesizer With RCDG, 960s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28	Speech Synthesizer With RCDG, 960s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28	Speech Synthesizer With RCDG, 960s, PDIP28, 0.600 INCH, PLASTIC, DIP-28	Speech Synthesizer With RCDG, 960s, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28	Speech Synthesizer With RCDG, 960s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28	Speech Synthesizer With RCDG, 960s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28
Is it lead-free?	Lead free	Lead free	Lead free	Contains lead	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	incompatible	conform to	conform to	conform to
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	DIP	TSOP	TSOP	DIP	DIP	SOIC	SOIC
package instruction	DIP,	TSOP1,	TSOP1,	DIP,	DIP,	SOP,	SOP,
Contacts	28	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Is Samacsys	N	N	N	N	N	N	N
application	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER	CAR STEREO; HANDSET; TRANSFORMER
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	R-PDIP-T28	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28
length	36.83 mm	11.8 mm	11.8 mm	36.83 mm	36.83 mm	17.93 mm	17.93 mm
Number of functions	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28
On-chip memory type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum operating temperature	85 °C	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-	-40 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	TSOP1	TSOP1	DIP	DIP	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	260	NOT SPECIFIED	NOT SPECIFIED	245	245
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum read time	960 s	960 s	960 s	960 s	960 s	960 s	960 s
Maximum seat height	4.83 mm	1.25 mm	1.25 mm	4.83 mm	4.83 mm	2.64 mm	2.64 mm
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
surface mount	NO	YES	YES	NO	NO	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	0.55 mm	0.55 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	40	40	NOT SPECIFIED	NOT SPECIFIED	40	40
width	15.24 mm	8 mm	8 mm	15.24 mm	15.24 mm	7.52 mm	7.52 mm
Base Number Matches	1	1	1	1	1	1	1

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