DS3172+ datasheet, PDF - EEWORLD Datasheet

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DS3172+: DescriptionTelecom Interface ICs Dual DS3/E3 Single Chip Transceiver; CategoryWireless rf/communication Telecom circuit; File Size2MB，234 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html; Environmental Compliance

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DS3172+ Overview

Telecom Interface ICs Dual DS3/E3 Single Chip Transceiver

DS3172+ Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Maxim
Parts packaging code	BGA
package instruction	27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400
Contacts	400
Reach Compliance Code	compliant
JESD-30 code	S-PBGA-B400
JESD-609 code	e1
length	27 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	400
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA400,20X20,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	2.54 mm
Maximum slew rate	0.328 mA
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	FRAMER
Temperature level	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm

DS3172+ Related Products

	DS3172+	DS3172N+	DS3174+	DS3171N+	DS3172
Description	Telecom Interface ICs Dual DS3/E3 Single Chip Transceiver	Telecom Interface ICs Dual DS3/E3 Single Chip Transceiver	Telecom Interface ICs Quad DS3/E3 Single Chip Transceiver	Telecom Interface ICs Single DS3/E3 Single Chip Transceiver	Telecom Interface ICs Dual DS3/E3 Single Chip Transceiver
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Contains lead
Is it Rohs certified?	conform to	conform to	conform to	conform to	incompatible
Maker	Maxim	Maxim	Maxim	Maxim	Maxim
Parts packaging code	BGA	BGA	BGA	BGA	BGA
package instruction	27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400	27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400	27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400	27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400	27 X 27 MM, 1.27 MM PITCH, CSBGA-400
Contacts	400	400	400	400	400
Reach Compliance Code	compliant	compliant	compliant	compliant	not_compliant
JESD-30 code	S-PBGA-B400	S-PBGA-B400	S-PBGA-B400	S-PBGA-B400	S-PBGA-B400
length	27 mm	27 mm	27 mm	27 mm	27 mm
Number of functions	1	1	1	1	1
Number of terminals	400	400	400	400	400
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA400,20X20,50	BGA400,20X20,50	BGA400,20X20,50	BGA400,20X20,50	BGA400,20X20,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	260	260	260	260	240
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Maximum slew rate	0.328 mA	0.328 mA	0.725 mA	0.273 mA	0.328 mA
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES
Telecom integrated circuit types	FRAMER	FRAMER	FRAMER	FRAMER	FRAMER
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	27 mm	27 mm	27 mm	27 mm	27 mm
JESD-609 code	e1	-	e1	e1	e0
Humidity sensitivity level	3	3	3	3	-
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	-	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead (Sn/Pb)
ECCN code	-	EAR99	-	EAR99	EAR99

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