NCP2811AMTTXG datasheet, PDF - EEWORLD Datasheet

NCP2811AMTTXG: DescriptionAudio Amplifiers HEADSET AUDIO AMP; CategoryAnalog mixed-signal IC Consumption circuit; File Size184KB，14 Pages; ManufacturerON Semiconductor; Websitehttp://www.onsemi.cn

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Audio Amplifiers HEADSET AUDIO AMP

Parameter Name	Attribute value
Brand Name	ON Semiconductor
Is it lead-free?	Lead free
Parts packaging code	QFN
package instruction	HVQCCN,
Contacts	12
Manufacturer packaging code	510AH
Reach Compliance Code	compliant
ECCN code	EAR99
Nominal bandwidth	20 kHz
Commercial integrated circuit types	AUDIO AMPLIFIER
JESD-30 code	S-XQCC-N12
JESD-609 code	e3
length	3 mm
Number of channels	2
Number of functions	2
Number of terminals	12
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	0.85 mm
Maximum supply voltage (Vsup)	5 V
Minimum supply voltage (Vsup)	2.7 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3 mm
Base Number Matches	1

	NCP2811AMTTXG	NCP2811BFCT1G
Description	Audio Amplifiers HEADSET AUDIO AMP	Audio Amplifiers HEADSET AUDIO AMPLIFIER
Brand Name	ON Semiconductor	ON Semiconductor
Is it lead-free?	Lead free	Lead free
Parts packaging code	QFN	BGA
package instruction	HVQCCN,	VFBGA,
Contacts	12	12
Manufacturer packaging code	510AH	499AZ
Reach Compliance Code	compliant	unknown
ECCN code	EAR99	EAR99
Nominal bandwidth	20 kHz	20 kHz
Commercial integrated circuit types	AUDIO AMPLIFIER	AUDIO AMPLIFIER
JESD-30 code	S-XQCC-N12	R-PBGA-B12
length	3 mm	2 mm
Number of channels	2	2
Number of functions	2	2
Number of terminals	12	12
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	HVQCCN	VFBGA
Package shape	SQUARE	RECTANGULAR
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified
Maximum seat height	0.85 mm	0.6 mm
Maximum supply voltage (Vsup)	5 V	5 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V
surface mount	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	BALL
Terminal pitch	0.5 mm	0.5 mm
Terminal location	QUAD	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	3 mm	1.5 mm
Base Number Matches	1	1

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