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DG3003DB-T1-E1

Description
Analog Switch ICs Low Volt Single SPDT
CategoryAnalog mixed-signal IC    The signal circuit   
File Size254KB,13 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
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DG3003DB-T1-E1 Overview

Analog Switch ICs Low Volt Single SPDT

DG3003DB-T1-E1 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
MakerVishay
Parts packaging codeBGA
package instructionVFBGA, BGA6,2X3,20
Contacts6
Reach Compliance Codeunknown
Analog Integrated Circuits - Other TypesSPDT
JESD-30 codeR-PBGA-B6
JESD-609 codee1
length1.5025 mm
Humidity sensitivity level1
Number of channels1
Number of functions1
Number of terminals6
Nominal off-state isolation70 dB
On-state resistance matching specifications0.01 Ω
Maximum on-state resistance (Ron)0.7 Ω
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA6,2X3,20
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply3 V
Certification statusNot Qualified
Maximum seat height0.753 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)3 V
surface mountYES
Maximum disconnect time59 ns
Maximum connection time71 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width1.0025 mm
Base Number Matches1

DG3003DB-T1-E1 Related Products

DG3003DB-T1-E1 DG3001DB-T1-E1
Description Analog Switch ICs Low Volt Single SPDT Analog Switch ICs Low Volt Single SPST
Is it lead-free? Lead free Lead free
Maker Vishay Vishay
Parts packaging code BGA BGA
package instruction VFBGA, BGA6,2X3,20 VFBGA, BGA6,2X3,20
Contacts 6 6
Reach Compliance Code unknown unknown
Analog Integrated Circuits - Other Types SPDT SPST
JESD-30 code R-PBGA-B6 R-PBGA-B6
JESD-609 code e1 e1
length 1.5025 mm 1.5025 mm
Humidity sensitivity level 1 1
Number of channels 1 1
Number of functions 1 1
Number of terminals 6 6
Nominal off-state isolation 70 dB 70 dB
On-state resistance matching specifications 0.01 Ω 0.01 Ω
Maximum on-state resistance (Ron) 0.7 Ω 0.7 Ω
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA VFBGA
Encapsulate equivalent code BGA6,2X3,20 BGA6,2X3,20
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260
power supply 3 V 3 V
Certification status Not Qualified Not Qualified
Maximum seat height 0.753 mm 0.753 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.8 V 1.8 V
Nominal supply voltage (Vsup) 3 V 3 V
surface mount YES YES
Maximum disconnect time 59 ns 59 ns
Maximum connection time 71 ns 71 ns
switch BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL
Terminal pitch 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 40 40
width 1.0025 mm 1.0025 mm
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