|
SST38VF6404-90-5C-EKE |
SST38VF6404-90-5C-B3KE |
SST38VF6403-90-5C-EKE |
SST38VF6402-90-5C-EKE |
SST38VF6402-90-5C-B3KE |
Description |
NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial |
Flash Memory 64M (4Mx16) 90ns 2.7-3.6V Commercial |
NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial |
NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial |
NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
TSOP1 |
BGA |
TSOP1 |
TSOP1 |
BGA |
package instruction |
TSOP1, TSSOP48,.8,20 |
TFBGA, BGA48,6X8,32 |
TSOP1, TSSOP48,.8,20 |
TSOP1, TSSOP48,.8,20 |
TFBGA-48 |
Contacts |
48 |
48 |
48 |
48 |
48 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN code |
3A991.B.1.A |
3A991.B.1.A |
3A991.B.1.A |
3A991.B.1.A |
3A991.B.1.A |
Factory Lead Time |
5 weeks |
16 weeks |
16 weeks |
16 weeks |
7 weeks |
Maximum access time |
90 ns |
90 ns |
90 ns |
90 ns |
90 ns |
Other features |
TOP BOOT BLOCK |
TOP BOOT BLOCK |
BOTTOM BOOT BLOCK |
TOP BOOT BLOCK |
TOP BOOT BLOCK |
startup block |
TOP |
TOP |
BOTTOM |
TOP |
TOP |
command user interface |
YES |
YES |
YES |
YES |
YES |
Universal Flash Interface |
YES |
YES |
YES |
YES |
YES |
Data polling |
YES |
YES |
YES |
YES |
YES |
JESD-30 code |
R-PDSO-G48 |
R-PBGA-B48 |
R-PDSO-G48 |
R-PDSO-G48 |
R-PBGA-B48 |
JESD-609 code |
e3 |
e1 |
e3 |
e3 |
e1 |
length |
18.4 mm |
8 mm |
18.4 mm |
18.4 mm |
8 mm |
memory density |
67108864 bit |
67108864 bit |
67108864 bit |
67108864 bit |
67108864 bit |
Memory IC Type |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
memory width |
16 |
16 |
16 |
16 |
16 |
Humidity sensitivity level |
3 |
3 |
3 |
3 |
3 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
Number of departments/size |
1K |
1K |
1K |
1K |
1K |
Number of terminals |
48 |
48 |
48 |
48 |
48 |
word count |
4194304 words |
4194304 words |
4194304 words |
4194304 words |
4194304 words |
character code |
4000000 |
4000000 |
4000000 |
4000000 |
4000000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
organize |
4MX16 |
4MX16 |
4MX16 |
4MX16 |
4MX16 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSOP1 |
TFBGA |
TSOP1 |
TSOP1 |
TFBGA |
Encapsulate equivalent code |
TSSOP48,.8,20 |
BGA48,6X8,32 |
TSSOP48,.8,20 |
TSSOP48,.8,20 |
BGA48,6X8,32 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE |
GRID ARRAY, THIN PROFILE, FINE PITCH |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
GRID ARRAY, THIN PROFILE, FINE PITCH |
page size |
4 words |
4 words |
4 words |
4 words |
4 words |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
power supply |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
Programming voltage |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
ready/busy |
YES |
YES |
YES |
YES |
YES |
Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
Department size |
4K |
4K |
4K |
4K |
4K |
Maximum standby current |
0.00003 A |
0.00003 A |
0.00003 A |
0.00003 A |
0.00003 A |
Maximum slew rate |
0.05 mA |
0.05 mA |
0.05 mA |
0.05 mA |
0.05 mA |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage (Vsup) |
3 V |
3 V |
3 V |
3 V |
3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Matte Tin (Sn) - annealed |
Tin/Silver/Copper (Sn/Ag/Cu) |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form |
GULL WING |
BALL |
GULL WING |
GULL WING |
BALL |
Terminal pitch |
0.5 mm |
0.8 mm |
0.5 mm |
0.5 mm |
0.8 mm |
Terminal location |
DUAL |
BOTTOM |
DUAL |
DUAL |
BOTTOM |
Maximum time at peak reflow temperature |
40 |
40 |
40 |
40 |
40 |
switch bit |
YES |
YES |
YES |
YES |
YES |
type |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
width |
12 mm |
6 mm |
12 mm |
12 mm |
6 mm |
Maker |
- |
- |
Microchip |
Microchip |
Microchip |