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SST38VF6402-90-5C-EKE

Description
NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial
Categorystorage    storage   
File Size7MB,67 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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SST38VF6402-90-5C-EKE Overview

NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial

SST38VF6402-90-5C-EKE Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeTSOP1
package instructionTSOP1, TSSOP48,.8,20
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Factory Lead Time16 weeks
Maximum access time90 ns
Other featuresTOP BOOT BLOCK
startup blockTOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G48
JESD-609 codee3
length18.4 mm
memory density67108864 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of departments/size1K
Number of terminals48
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP48,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
page size4 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3/3.3 V
Programming voltage2.7 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size4K
Maximum standby current0.00003 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
switch bitYES
typeNOR TYPE
width12 mm

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Description NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial Flash Memory 64M (4Mx16) 90ns 2.7-3.6V Commercial NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
Parts packaging code TSOP1 BGA TSOP1 BGA TSOP1
package instruction TSOP1, TSSOP48,.8,20 TFBGA, BGA48,6X8,32 TSOP1, TSSOP48,.8,20 TFBGA-48 TSOP1, TSSOP48,.8,20
Contacts 48 48 48 48 48
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Factory Lead Time 16 weeks 16 weeks 16 weeks 7 weeks 5 weeks
Maximum access time 90 ns 90 ns 90 ns 90 ns 90 ns
Other features TOP BOOT BLOCK TOP BOOT BLOCK BOTTOM BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK
startup block TOP TOP BOTTOM TOP TOP
command user interface YES YES YES YES YES
Universal Flash Interface YES YES YES YES YES
Data polling YES YES YES YES YES
JESD-30 code R-PDSO-G48 R-PBGA-B48 R-PDSO-G48 R-PBGA-B48 R-PDSO-G48
JESD-609 code e3 e1 e3 e1 e3
length 18.4 mm 8 mm 18.4 mm 8 mm 18.4 mm
memory density 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16
Humidity sensitivity level 3 3 3 3 3
Number of functions 1 1 1 1 1
Number of departments/size 1K 1K 1K 1K 1K
Number of terminals 48 48 48 48 48
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
organize 4MX16 4MX16 4MX16 4MX16 4MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 TFBGA TSOP1 TFBGA TSOP1
Encapsulate equivalent code TSSOP48,.8,20 BGA48,6X8,32 TSSOP48,.8,20 BGA48,6X8,32 TSSOP48,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
page size 4 words 4 words 4 words 4 words 4 words
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Programming voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ready/busy YES YES YES YES YES
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Department size 4K 4K 4K 4K 4K
Maximum standby current 0.00003 A 0.00003 A 0.00003 A 0.00003 A 0.00003 A
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Matte Tin (Sn) - annealed Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) - annealed Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) - annealed
Terminal form GULL WING BALL GULL WING BALL GULL WING
Terminal pitch 0.5 mm 0.8 mm 0.5 mm 0.8 mm 0.5 mm
Terminal location DUAL BOTTOM DUAL BOTTOM DUAL
Maximum time at peak reflow temperature 40 40 40 40 40
switch bit YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 12 mm 6 mm 12 mm 6 mm 12 mm
Maker Microchip - Microchip Microchip -

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