EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

SST38VF6402-90-5C-B3KE

Description
NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial
Categorystorage    storage   
File Size7MB,67 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Parametric Compare View All

SST38VF6402-90-5C-B3KE Online Shopping

Suppliers Part Number Price MOQ In stock  
SST38VF6402-90-5C-B3KE - - View Buy Now

SST38VF6402-90-5C-B3KE Overview

NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial

SST38VF6402-90-5C-B3KE Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeBGA
package instructionTFBGA-48
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Factory Lead Time7 weeks
Maximum access time90 ns
Other featuresTOP BOOT BLOCK
startup blockTOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B48
JESD-609 codee1
length8 mm
memory density67108864 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of departments/size1K
Number of terminals48
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA48,6X8,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
page size4 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3/3.3 V
Programming voltage2.7 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size4K
Maximum standby current0.00003 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
switch bitYES
typeNOR TYPE
width6 mm

SST38VF6402-90-5C-B3KE Related Products

SST38VF6402-90-5C-B3KE SST38VF6404-90-5C-B3KE SST38VF6403-90-5C-EKE SST38VF6402-90-5C-EKE SST38VF6404-90-5C-EKE
Description NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial Flash Memory 64M (4Mx16) 90ns 2.7-3.6V Commercial NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial NOR Flash 64M (4Mx16) 90ns 2.7-3.6V Commercial
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
Parts packaging code BGA BGA TSOP1 TSOP1 TSOP1
package instruction TFBGA-48 TFBGA, BGA48,6X8,32 TSOP1, TSSOP48,.8,20 TSOP1, TSSOP48,.8,20 TSOP1, TSSOP48,.8,20
Contacts 48 48 48 48 48
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Factory Lead Time 7 weeks 16 weeks 16 weeks 16 weeks 5 weeks
Maximum access time 90 ns 90 ns 90 ns 90 ns 90 ns
Other features TOP BOOT BLOCK TOP BOOT BLOCK BOTTOM BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK
startup block TOP TOP BOTTOM TOP TOP
command user interface YES YES YES YES YES
Universal Flash Interface YES YES YES YES YES
Data polling YES YES YES YES YES
JESD-30 code R-PBGA-B48 R-PBGA-B48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48
JESD-609 code e1 e1 e3 e3 e3
length 8 mm 8 mm 18.4 mm 18.4 mm 18.4 mm
memory density 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16
Humidity sensitivity level 3 3 3 3 3
Number of functions 1 1 1 1 1
Number of departments/size 1K 1K 1K 1K 1K
Number of terminals 48 48 48 48 48
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
organize 4MX16 4MX16 4MX16 4MX16 4MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA TSOP1 TSOP1 TSOP1
Encapsulate equivalent code BGA48,6X8,32 BGA48,6X8,32 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
page size 4 words 4 words 4 words 4 words 4 words
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Programming voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ready/busy YES YES YES YES YES
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Department size 4K 4K 4K 4K 4K
Maximum standby current 0.00003 A 0.00003 A 0.00003 A 0.00003 A 0.00003 A
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal form BALL BALL GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 40 40 40 40
switch bit YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 6 mm 6 mm 12 mm 12 mm 12 mm
Maker Microchip - Microchip Microchip -
Generate .bin .hex .txt files on CCS and burn them to MSP430 to make the LCD light up
1. Create the project file correctly on CCS. New Project: File-New-CCS Project2. Write the program in the main.c file and save it.1 #include msp430f169.h2 /*3 * Software delay4 */5 #define CPU_F1 ((do...
火辣西米秀 Microcontroller MCU
Digital video image elimination based on FPGADSP...
...
至芯科技FPGA大牛 FPGA/CPLD
Award-winning live broadcast: Registration is open for TI desktop DLP 3D printing, 3D scanning and industrial display applications based on DLP Pico technology~
Award-winning live broadcast: Registration is open for TI desktop DLP 3D printing, 3D scanning and industrial display applications based on DLPPico technology~Click here to registerLive broadcast time...
EEWORLD社区 TI Technology Forum
Is there any pure hardware?
I can only pull wires, draw, and solder, but I can’t program at all!...
花好月圆510 Talking
"Pingtou Ge Jianchi CDK Quick Start Guide"
The problem of making a custom SDK in the Jianchi CDK development environment, "Pingtou Ge Jianchi CDK Quick Start Guide" is convenient for developers to customize the SDK of their own platform. I hop...
火辣西米秀 Domestic Chip Exchange
Pedometer to measure steps/distance/speed
A pedometer is a device that counts the number of steps a person takes and calculates the distance by multiplying the number of steps by the length of the step. This design uses an AVR MCV to build a ...
fighting Test/Measurement

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号