LH28F008SCB-L12 datasheet, PDF

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LH28F008SCB-L12: DescriptionFlash Memory 8M (1MB 】 8); Categorystorage storage; File Size528KB，55 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH28F008SCB-L12 Overview

Flash Memory 8M (1MB 】 8)

LH28F008SCB-L12 Parametric

Parameter Name	Attribute value
Maker	SHARP
package instruction	6 X 8 MM, PLASTIC, CSP, FBGA-48
Reach Compliance Code	unknow
Maximum access time	170 ns
Other features	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V
JESD-30 code	R-PBGA-B48
length	8 mm
memory density	8388608 bi
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Programming voltage	3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
type	NOR TYPE
width	6 mm

LH28F008SCB-L12 Related Products

	LH28F008SCB-L12	LH28F008SCHR-L85	LH28F008SCT-L12	LH28F008SCN-L12	LH28F008SCHT-L12	LH28F008SCHR-L12	LH28F008SCHN-L12	LH28F008SCHB-L12
Description	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)
Maker	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP
package instruction	6 X 8 MM, PLASTIC, CSP, FBGA-48	10 X 20 MM, PLASTIC, REVERSE, TSOP1-40	10 X 20 MM, PLASTIC, TSOP1-40	0.600 INCH, PLASTIC, SOP-44	10 X 20 MM, PLASTIC, TSOP1-40	10 X 20 MM, PLASTIC, REVERSE, TSOP1-40	0.600 INCH, PLASTIC, SOP-44	6 X 8 MM, PLASTIC, CSP, FBGA-48
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
Maximum access time	170 ns	150 ns	170 ns	170 ns	170 ns	170 ns	170 ns	170 ns
Other features	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V	ACCESS TIME 120 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V
JESD-30 code	R-PBGA-B48	R-PDSO-G40	R-PDSO-G40	R-PDSO-G44	R-PDSO-G40	R-PDSO-G40	R-PDSO-G44	R-PBGA-B48
length	8 mm	18.4 mm	18.4 mm	28.2 mm	18.4 mm	18.4 mm	28.2 mm	8 mm
memory density	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	48	40	40	44	40	40	44	48
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-	-25 °C	-	-	-25 °C	-25 °C	-25 °C	-25 °C
organize	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TSOP1-R	TSOP1	SOP	TSOP1	TSOP1-R	SOP	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Programming voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	3.15 mm	1.2 mm	1.2 mm	3.15 mm	1.2 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	OTHER	COMMERCIAL	COMMERCIAL	OTHER	OTHER	OTHER	OTHER
Terminal form	BALL	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL
Terminal pitch	0.8 mm	0.5 mm	0.5 mm	1.27 mm	0.5 mm	0.5 mm	1.27 mm	0.8 mm
Terminal location	BOTTOM	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	BOTTOM
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	6 mm	10 mm	10 mm	13.2 mm	10 mm	10 mm	13.2 mm	6 mm
JESD-609 code	-	e0	e6	e6	e6	e6	e6	-
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Terminal surface	-	TIN LEAD	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	-
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-

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