LH28F008SCHR-L85 datasheet, PDF

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LH28F008SCHR-L85: DescriptionFlash Memory 8M (1MB 】 8); Categorystorage storage; File Size528KB，55 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH28F008SCHR-L85 Overview

Flash Memory 8M (1MB 】 8)

LH28F008SCHR-L85 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SHARP
package instruction	10 X 20 MM, PLASTIC, REVERSE, TSOP1-40
Reach Compliance Code	unknow
Maximum access time	150 ns
Other features	ACCESS TIME 120 NS AT VCC 3.3+/-0.3V
JESD-30 code	R-PDSO-G40
JESD-609 code	e0
length	18.4 mm
memory density	8388608 bi
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	40
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	1MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1-R
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NOR TYPE
width	10 mm

LH28F008SCHR-L85 Related Products

	LH28F008SCHR-L85	LH28F008SCT-L12	LH28F008SCN-L12	LH28F008SCHT-L12	LH28F008SCHR-L12	LH28F008SCB-L12	LH28F008SCHN-L12	LH28F008SCHB-L12
Description	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)	Flash Memory 8M (1MB 】 8)
Maker	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP
package instruction	10 X 20 MM, PLASTIC, REVERSE, TSOP1-40	10 X 20 MM, PLASTIC, TSOP1-40	0.600 INCH, PLASTIC, SOP-44	10 X 20 MM, PLASTIC, TSOP1-40	10 X 20 MM, PLASTIC, REVERSE, TSOP1-40	6 X 8 MM, PLASTIC, CSP, FBGA-48	0.600 INCH, PLASTIC, SOP-44	6 X 8 MM, PLASTIC, CSP, FBGA-48
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
Maximum access time	150 ns	170 ns	170 ns	170 ns	170 ns	170 ns	170 ns	170 ns
Other features	ACCESS TIME 120 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V	ACCESS TIME 150 NS AT VCC 3.3+/-0.3V
JESD-30 code	R-PDSO-G40	R-PDSO-G40	R-PDSO-G44	R-PDSO-G40	R-PDSO-G40	R-PBGA-B48	R-PDSO-G44	R-PBGA-B48
length	18.4 mm	18.4 mm	28.2 mm	18.4 mm	18.4 mm	8 mm	28.2 mm	8 mm
memory density	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	40	40	44	40	40	48	44	48
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C	85 °C	70 °C	85 °C	85 °C
Minimum operating temperature	-25 °C	-	-	-25 °C	-25 °C	-	-25 °C	-25 °C
organize	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1-R	TSOP1	SOP	TSOP1	TSOP1-R	TFBGA	SOP	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Programming voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	3.15 mm	1.2 mm	1.2 mm	1.2 mm	3.15 mm	1.2 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	COMMERCIAL	COMMERCIAL	OTHER	OTHER	COMMERCIAL	OTHER	OTHER
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL	GULL WING	BALL
Terminal pitch	0.5 mm	0.5 mm	1.27 mm	0.5 mm	0.5 mm	0.8 mm	1.27 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	BOTTOM	DUAL	BOTTOM
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	10 mm	10 mm	13.2 mm	10 mm	10 mm	6 mm	13.2 mm	6 mm
JESD-609 code	e0	e6	e6	e6	e6	-	e6	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-
Terminal surface	TIN LEAD	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	-	TIN BISMUTH	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-

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