574MILF datasheet, PDF - EEWORLD Datasheet

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574MILF: DescriptionSOIC-8, Tube; Categorylogic; File Size278KB，8 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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574MILF Overview

SOIC-8, Tube

574MILF Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	SOIC
package instruction	SOP, SOP8,.25
Contacts	8
Manufacturer packaging code	DCG8
Reach Compliance Code	compliant
ECCN code	EAR99
Samacsys Confidence	3
Samacsys Status	Released
Samacsys PartID	11129114
Samacsys Pin Count	8
Samacsys Part Category	Integrated Circuit
Samacsys Package Category	Small Outline Packages
Samacsys Footprint Name	8-pin SOIC, 150 Mil. Body
Samacsys Released Date	2020-01-20 13:06:46
Is Samacsys	N
series	574
Input adjustment	STANDARD
JESD-30 code	R-PDSO-G8
JESD-609 code	e3
length	4.9 mm
Logic integrated circuit type	PLL BASED CLOCK DRIVER
MaximumI(ol)	0.018 A
Humidity sensitivity level	1
Number of functions	1
Number of inverted outputs
Number of terminals	8
Actual output times	4
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
Same Edge Skew-Max（tskwd）	0.15 ns
Maximum seat height	1.75 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3.9 mm
minfmax	160 MHz
Base Number Matches	1

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DATASHEET

ZERO DELAY, LOW SKEW BUFFER

Description

The ICS574 is a low jitter, low-skew, high performance

PLL-based zero delay buffer for high speed applications.

Based on IDT’s proprietary low jitter Phase Locked Loop

(PLL) techniques, the device provides four low skew

outputs at speeds up to 160 MHz at 3.3 V. When one of the

outputs is connected directly to FBIN, the rising edge of

each output is aligned with the rising edge of the input

clock. External delay elements connected in the feedback

loops will cause the outputs to occur before the inputs by

the amount of propagation delay of the external element.

ICS574

Features

•

Packaged in 8 pin narrow SOIC, Pb (lead) free

Zero input-to-output delay

Four 1X outputs

Output to output skew is less than 150 ps

Output clocks up to 160 MHz at 3.3 V

External feedback path for output edge placement

Spread Smart™ technology works with spread spectrum

clock generators

TTL levels at 3.3 V

•

Full CMOS outputs with 18 mA output drive capability at

•

Advanced, low power, sub-micron CMOS process

•

Operating voltage from 3.0 to 5.5 V

•

Industrial temperature version available

Block Diagram

CLK1

FBIN

CLKIN

CLK2

PLL

CLK3

CLK4

IDT™/ ICS™

ZERO DELAY, LOW SKEW BUFFER

ICS574

REV G 051310

574MILF Related Products

	574MILF	574MLFT
Description	SOIC-8, Tube	SOIC-8, Reel
Brand Name	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Parts packaging code	SOIC	SOIC
package instruction	SOP, SOP8,.25	SOP, SOP8,.25
Contacts	8	8
Manufacturer packaging code	DCG8	DCG8
Reach Compliance Code	compliant	compliant
ECCN code	EAR99	EAR99
series	574	574
Input adjustment	STANDARD	STANDARD
JESD-30 code	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e3	e3
length	4.9 mm	4.9 mm
Logic integrated circuit type	PLL BASED CLOCK DRIVER	PLL BASED CLOCK DRIVER
MaximumI(ol)	0.018 A	0.018 A
Humidity sensitivity level	1	1
Number of functions	1	1
Number of terminals	8	8
Actual output times	4	4
Maximum operating temperature	85 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP
Encapsulate equivalent code	SOP8,.25	SOP8,.25
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260	260
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Same Edge Skew-Max（tskwd）	0.15 ns	0.15 ns
Maximum seat height	1.75 mm	1.75 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL
Terminal surface	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	30	30
width	3.9 mm	3.9 mm
minfmax	160 MHz	160 MHz
Base Number Matches	1	1

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