Standard SRAM, 512KX8, 25ns, CMOS, BOTTOM BRAZED, CERAMIC, DFP-36
Parameter Name | Attribute value |
Maker | Defense Logistics Agency |
Parts packaging code | DFP |
package instruction | DFP, |
Contacts | 36 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 25 ns |
JESD-609 code | e0 |
memory density | 4194304 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 512KX8 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DFP |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Filter level | MIL-PRF-38535 Class T |
Maximum seat height | 3.048 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 12.192 mm |
Base Number Matches | 1 |
5962-9960701TUA | 5962-9960701TUC | 5962-9960701TUX | |
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Description | Standard SRAM, 512KX8, 25ns, CMOS, BOTTOM BRAZED, CERAMIC, DFP-36 | Standard SRAM, 512KX8, 25ns, CMOS, BOTTOM BRAZED, CERAMIC, DFP-36 | Standard SRAM, 512KX8, 25ns, CMOS, BOTTOM BRAZED, CERAMIC, DFP-36 |
Maker | Defense Logistics Agency | Defense Logistics Agency | Defense Logistics Agency |
Parts packaging code | DFP | DFP | DFP |
package instruction | DFP, | DFP, | DFP, |
Contacts | 36 | 36 | 36 |
Reach Compliance Code | unknown | unknown | unknown |
ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
Maximum access time | 25 ns | 25 ns | 25 ns |
memory density | 4194304 bit | 4194304 bit | 4194304 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 |
word count | 524288 words | 524288 words | 524288 words |
character code | 512000 | 512000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C |
organize | 512KX8 | 512KX8 | 512KX8 |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DFP | DFP | DFP |
Package form | FLATPACK | FLATPACK | FLATPACK |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Filter level | MIL-PRF-38535 Class T | MIL-PRF-38535 Class T | MIL-PRF-38535 Class T |
Maximum seat height | 3.048 mm | 3.048 mm | 3.048 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY |
Terminal form | FLAT | FLAT | FLAT |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL |
width | 12.192 mm | 12.192 mm | 12.192 mm |
JESD-609 code | e0 | e4 | - |
Terminal surface | TIN LEAD | GOLD | - |
Base Number Matches | 1 | 1 | - |