Standard SRAM, 512KX8, 25ns, CMOS, BOTTOM BRAZED, CERAMIC, DFP-36
| Parameter Name | Attribute value |
| Maker | Defense Logistics Agency |
| Parts packaging code | DFP |
| package instruction | DFP, |
| Contacts | 36 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 25 ns |
| memory density | 4194304 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 512KX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Filter level | MIL-PRF-38535 Class T |
| Maximum seat height | 3.048 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 12.192 mm |
| 5962-9960701TUX | 5962-9960701TUA | 5962-9960701TUC | |
|---|---|---|---|
| Description | Standard SRAM, 512KX8, 25ns, CMOS, BOTTOM BRAZED, CERAMIC, DFP-36 | Standard SRAM, 512KX8, 25ns, CMOS, BOTTOM BRAZED, CERAMIC, DFP-36 | Standard SRAM, 512KX8, 25ns, CMOS, BOTTOM BRAZED, CERAMIC, DFP-36 |
| Maker | Defense Logistics Agency | Defense Logistics Agency | Defense Logistics Agency |
| Parts packaging code | DFP | DFP | DFP |
| package instruction | DFP, | DFP, | DFP, |
| Contacts | 36 | 36 | 36 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Maximum access time | 25 ns | 25 ns | 25 ns |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| word count | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 512KX8 | 512KX8 | 512KX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP | DFP | DFP |
| Package form | FLATPACK | FLATPACK | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Filter level | MIL-PRF-38535 Class T | MIL-PRF-38535 Class T | MIL-PRF-38535 Class T |
| Maximum seat height | 3.048 mm | 3.048 mm | 3.048 mm |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | FLAT | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL |
| width | 12.192 mm | 12.192 mm | 12.192 mm |
| JESD-609 code | - | e0 | e4 |
| Terminal surface | - | TIN LEAD | GOLD |
| Base Number Matches | - | 1 | 1 |
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