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WF1M32B-150HC3

Description
Flash Module, 1MX32, 150ns, CHIP66, PGA TYPE, CERAMIC, HIP-66
Categorystorage    storage   
File Size239KB,13 Pages
ManufacturerWhite Microelectronics
Download Datasheet Parametric View All

WF1M32B-150HC3 Overview

Flash Module, 1MX32, 150ns, CHIP66, PGA TYPE, CERAMIC, HIP-66

WF1M32B-150HC3 Parametric

Parameter NameAttribute value
MakerWhite Microelectronics
package instruction,
Reach Compliance Codeunknown
Maximum access time150 ns
Other featuresUSER CONFIGURABLE 1M X 32; 1000000 ERASE/PROGRAM CYCLES; MINIMUM 20 YEARS DATA RETENTION
startup blockBOTTOM
Data retention time - minimum20
JESD-30 codeS-CHIP-P66
memory density33554432 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals66
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeSQUARE
Package formIN-LINE
Parallel/SerialPARALLEL
Programming voltage3.3 V
Certification statusNot Qualified
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formPIN/PEG
Terminal locationHEX
typeNOR TYPE
Base Number Matches1
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