M368L3313DTL-CB3 datasheet, PDF

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M368L3313DTL-CB3: Description256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM); Categorystorage storage; File Size88KB，12 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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M368L3313DTL-CB3 Overview

256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM)

M368L3313DTL-CB3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	DIMM
package instruction	DIMM, DIMM184
Contacts	184
Reach Compliance Code	compli
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Maximum access time	0.7 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N184
memory density	2147483648 bi
Memory IC Type	DDR DRAM MODULE
memory width	64
Humidity sensitivity level	1
Number of functions	1
Number of ports	1
Number of terminals	184
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM184
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	225
power supply	2.5 V
Certification status	Not Qualified
refresh cycle	4096
self refresh	YES
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

M368L3313DTL-CB3 Related Products

	M368L3313DTL-CB3	M368L3313DTL	M368L3313DTL-CA2	M368L3313DTL-CB0
Description	256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM)	256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM)	256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM)	256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM)
Is it Rohs certified?	incompatible	-	incompatible	incompatible
Maker	SAMSUNG	-	SAMSUNG	SAMSUNG
Parts packaging code	DIMM	-	DIMM	DIMM
package instruction	DIMM, DIMM184	-	DIMM, DIMM184	DIMM, DIMM184
Contacts	184	-	184	184
Reach Compliance Code	compli	-	compli	compli
ECCN code	EAR99	-	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	-	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	0.7 ns	-	0.75 ns	0.75 ns
Other features	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz	-	133 MHz	133 MHz
I/O type	COMMON	-	COMMON	COMMON
JESD-30 code	R-XDMA-N184	-	R-XDMA-N184	R-XDMA-N184
memory density	2147483648 bi	-	2147483648 bi	2147483648 bi
Memory IC Type	DDR DRAM MODULE	-	DDR DRAM MODULE	DDR DRAM MODULE
memory width	64	-	64	64
Humidity sensitivity level	1	-	1	1
Number of functions	1	-	1	1
Number of ports	1	-	1	1
Number of terminals	184	-	184	184
word count	33554432 words	-	33554432 words	33554432 words
character code	32000000	-	32000000	32000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	-	70 °C	70 °C
organize	32MX64	-	32MX64	32MX64
Output characteristics	3-STATE	-	3-STATE	3-STATE
Package body material	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	-	DIMM	DIMM
Encapsulate equivalent code	DIMM184	-	DIMM184	DIMM184
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	-	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	225	-	225	225
power supply	2.5 V	-	2.5 V	2.5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified
refresh cycle	4096	-	4096	4096
self refresh	YES	-	YES	YES
Maximum supply voltage (Vsup)	2.7 V	-	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	-	2.3 V	2.3 V
Nominal supply voltage (Vsup)	2.5 V	-	2.5 V	2.5 V
surface mount	NO	-	NO	NO
technology	CMOS	-	CMOS	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	-	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm
Terminal location	DUAL	-	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED

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