|
M368L3313DTL-CA2 |
M368L3313DTL |
M368L3313DTL-CB0 |
M368L3313DTL-CB3 |
Description |
256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM) |
256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM) |
256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM) |
256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM) |
Is it Rohs certified? |
incompatible |
- |
incompatible |
incompatible |
Maker |
SAMSUNG |
- |
SAMSUNG |
SAMSUNG |
Parts packaging code |
DIMM |
- |
DIMM |
DIMM |
package instruction |
DIMM, DIMM184 |
- |
DIMM, DIMM184 |
DIMM, DIMM184 |
Contacts |
184 |
- |
184 |
184 |
Reach Compliance Code |
compli |
- |
compli |
compli |
ECCN code |
EAR99 |
- |
EAR99 |
EAR99 |
access mode |
DUAL BANK PAGE BURST |
- |
DUAL BANK PAGE BURST |
DUAL BANK PAGE BURST |
Maximum access time |
0.75 ns |
- |
0.75 ns |
0.7 ns |
Other features |
AUTO/SELF REFRESH |
- |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) |
133 MHz |
- |
133 MHz |
166 MHz |
I/O type |
COMMON |
- |
COMMON |
COMMON |
JESD-30 code |
R-XDMA-N184 |
- |
R-XDMA-N184 |
R-XDMA-N184 |
memory density |
2147483648 bi |
- |
2147483648 bi |
2147483648 bi |
Memory IC Type |
DDR DRAM MODULE |
- |
DDR DRAM MODULE |
DDR DRAM MODULE |
memory width |
64 |
- |
64 |
64 |
Humidity sensitivity level |
1 |
- |
1 |
1 |
Number of functions |
1 |
- |
1 |
1 |
Number of ports |
1 |
- |
1 |
1 |
Number of terminals |
184 |
- |
184 |
184 |
word count |
33554432 words |
- |
33554432 words |
33554432 words |
character code |
32000000 |
- |
32000000 |
32000000 |
Operating mode |
SYNCHRONOUS |
- |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
70 °C |
- |
70 °C |
70 °C |
organize |
32MX64 |
- |
32MX64 |
32MX64 |
Output characteristics |
3-STATE |
- |
3-STATE |
3-STATE |
Package body material |
UNSPECIFIED |
- |
UNSPECIFIED |
UNSPECIFIED |
encapsulated code |
DIMM |
- |
DIMM |
DIMM |
Encapsulate equivalent code |
DIMM184 |
- |
DIMM184 |
DIMM184 |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
Package form |
MICROELECTRONIC ASSEMBLY |
- |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) |
225 |
- |
225 |
225 |
power supply |
2.5 V |
- |
2.5 V |
2.5 V |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
refresh cycle |
4096 |
- |
4096 |
4096 |
self refresh |
YES |
- |
YES |
YES |
Maximum supply voltage (Vsup) |
2.7 V |
- |
2.7 V |
2.7 V |
Minimum supply voltage (Vsup) |
2.3 V |
- |
2.3 V |
2.3 V |
Nominal supply voltage (Vsup) |
2.5 V |
- |
2.5 V |
2.5 V |
surface mount |
NO |
- |
NO |
NO |
technology |
CMOS |
- |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
- |
COMMERCIAL |
COMMERCIAL |
Terminal form |
NO LEAD |
- |
NO LEAD |
NO LEAD |
Terminal pitch |
1.27 mm |
- |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
- |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |