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EP3C40U484I7

Description
FPGA - Field Programmable Gate Array FPGA - Cyclone III 2475 LABs 331 IOs
CategoryProgrammable logic devices    Programmable logic   
File Size300KB,14 Pages
ManufacturerAltera (Intel)
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EP3C40U484I7 Overview

FPGA - Field Programmable Gate Array FPGA - Cyclone III 2475 LABs 331 IOs

EP3C40U484I7 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAltera (Intel)
Parts packaging codeBGA
package instruction19 X 19 MM, 0.80 MM PITCH, UBGA-484
Contacts484
Reach Compliance Codenot_compliant
ECCN code3A001.A.7.A
maximum clock frequency472.5 MHz
JESD-30 codeS-PBGA-B484
JESD-609 codee0
length19 mm
Humidity sensitivity level3
Configurable number of logic blocks39600
Number of entries331
Number of logical units39600
Output times331
Number of terminals484
Maximum operating temperature100 °C
Minimum operating temperature-40 °C
organize39600 CLBS
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA484,22X22,32
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)220
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum seat height2.05 mm
Maximum supply voltage1.25 V
Minimum supply voltage1.15 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width19 mm
Base Number Matches1
1. Cyclone III Device Family Overview
July 2012
CIII51001-2.4
CIII51001-2.4
Cyclone
®
III device family offers a unique combination of high functionality, low
power and low cost. Based on Taiwan Semiconductor Manufacturing Company
(TSMC) low-power (LP) process technology, silicon optimizations and software
features to minimize power consumption, Cyclone III device family provides the ideal
solution for your high-volume, low-power, and cost-sensitive applications. To address
the unique design needs, Cyclone III device family offers the following two variants:
Cyclone III—lowest power, high functionality with the lowest cost
Cyclone III LS—lowest power FPGAs with security
With densities ranging from about 5,000 to 200,000 logic elements (LEs) and
0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power
consumption, Cyclone III device family makes it easier for you to meet your power
budget. Cyclone III LS devices are the first to implement a suite of security features at
the silicon, software, and intellectual property (IP) level on a low-power and
high-functionality FPGA platform. This suite of security features protects the IP from
tampering, reverse engineering and cloning. In addition, Cyclone III LS devices
support design separation which enables you to introduce redundancy in a single
chip to reduce size, weight, and power of your application.
This chapter contains the following sections:
“Cyclone III Device Family Features” on page 1–1
“Cyclone III Device Family Architecture” on page 1–6
“Reference and Ordering Information” on page 1–12
Cyclone III Device Family Features
Cyclone III device family offers the following features:
Lowest Power FPGAs
Lowest power consumption with TSMC low-power process technology and
Altera
®
power-aware design flow
Low-power operation offers the following benefits:
Extended battery life for portable and handheld applications
Reduced or eliminated cooling system costs
Operation in thermally-challenged environments
Hot-socketing operation support
© 2012 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos
are trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other countries. All other words and logos identified as
trademarks or service marks are the property of their respective holders as described at
www.altera.com/common/legal.html.
Altera warrants performance of its
semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any products and
services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service
described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device specifications before relying
on any published information and before placing orders for products or services.
ISO
9001:2008
Registered
Cyclone III Device Handbook
Volume 1
July 2012
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Description FPGA - Field Programmable Gate Array FPGA - Cyclone III 2475 LABs 331 IOs FPGA - Field Programmable Gate Array FPGA - Cyclone III 4388 LABs 429 IOs FPGA - Field Programmable Gate Array FPGA - Cyclone III 321 LABs 182 IOs FPGA - Field Programmable Gate Array FPGA - Cyclone III 3491 LABs 327 IOs FPGA - Field Programmable Gate Array FPGA - Cyclone III 2475 LABs 535 IOs FPGA - Field Programmable Gate Array FPGA - Cyclone III 5079 LABs 295 IOs FPGA - Field Programmable Gate Array FPGA - Cyclone III 4388 LABs 294 IOs FPGA - Field Programmable Gate Array FPGA - Cyclone III 645 LABs 182 IOs FPGA - Field Programmable Gate Array FPGA - Cyclone III 2475 LABs 195 IOs FPGA - Field Programmable Gate Array FPGA - Cyclone III 1539 LABs 215 IOs
Is it lead-free? Contains lead Lead free Lead free Lead free Lead free Contains lead Lead free Lead free Lead free Lead free
Is it Rohs certified? incompatible conform to conform to conform to conform to incompatible conform to conform to conform to conform to
Parts packaging code BGA BGA BGA BGA BGA BGA BGA BGA BGA BGA
package instruction 19 X 19 MM, 0.80 MM PITCH, UBGA-484 LEAD FREE, FBGA-780 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 23 X 23 MM, 2.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-484 29 X 29 MM, 2.60 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-780 19 X 19 MM, 0.80 MM PITCH, UBGA-484 LEAD FREE, UBGA-484 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 19 X 19 MM, 2.20 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-324 BGA, BGA324,18X18,40
Contacts 484 780 256 484 780 484 484 256 324 324
Reach Compliance Code not_compliant unknown unknown unknown unknown not_compliant unknown unknown unknown unknown
ECCN code 3A001.A.7.A 3A991 EAR99 3A991 3A001.A.7.A 3A991 3A991 EAR99 3A001.A.7.A 3A991
maximum clock frequency 472.5 MHz 450 MHz 472.5 MHz 472.5 MHz 472.5 MHz 472.5 MHz 450 MHz 472.5 MHz 472.5 MHz 472.5 MHz
JESD-30 code S-PBGA-B484 S-PBGA-B780 R-PBGA-B256 R-PBGA-B484 R-PBGA-B780 S-PBGA-B484 S-PBGA-B484 R-PBGA-B256 R-PBGA-B324 R-PBGA-B324
JESD-609 code e0 e1 e1 e1 e1 e0 e1 e1 e1 e1
length 19 mm 29 mm 17 mm 23 mm 29 mm 19 mm 19 mm 17 mm 19 mm 19 mm
Humidity sensitivity level 3 3 3 3 3 3 3 3 3 3
Configurable number of logic blocks 39600 70208 5136 55856 39600 81264 70208 10320 39600 24624
Number of entries 331 413 182 327 535 295 413 182 195 215
Number of logical units 39600 70208 5136 55856 39600 81264 70208 10320 39600 24624
Output times 331 413 182 327 535 295 413 182 195 215
Number of terminals 484 780 256 484 780 484 484 256 324 324
Maximum operating temperature 100 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 100 °C
organize 39600 CLBS 70208 CLBS 5136 CLBS 55856 CLBS 39600 CLBS 81264 CLBS 70208 CLBS 10320 CLBS 39600 CLBS 24624 CLBS
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA BGA LBGA BGA BGA FBGA FBGA LBGA BGA BGA
Encapsulate equivalent code BGA484,22X22,32 BGA780,28X28,40 BGA256,16X16,40 BGA484,22X22,40 BGA780,28X28,40 BGA484,22X22,32 BGA484,22X22,32 BGA256,16X16,40 BGA324,18X18,40 BGA324,18X18,40
Package shape SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, FINE PITCH GRID ARRAY GRID ARRAY, LOW PROFILE GRID ARRAY GRID ARRAY GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, LOW PROFILE GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 220 245 260 260 245 220 260 260 260 260
Programmable logic type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.05 mm 2.4 mm 1.55 mm 2.6 mm 3.5 mm 2.05 mm 2.05 mm 1.55 mm 2.2 mm 2.2 mm
Maximum supply voltage 1.25 V 1.25 V 1.25 V 1.25 V 1.25 V 1.25 V 1.25 V 1.25 V 1.25 V 1.25 V
Minimum supply voltage 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V 1.15 V
Nominal supply voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL OTHER OTHER OTHER OTHER OTHER OTHER OTHER OTHER INDUSTRIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 1 mm 1 mm 1 mm 1 mm 0.8 mm 0.5 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 40 40 40 40 30 40 30 40 40
width 19 mm 29 mm 17 mm 23 mm 29 mm 19 mm 19 mm 17 mm 19 mm 19 mm
Maker Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) -
Base Number Matches 1 - - 1 1 1 - - 1 1
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