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SMJ320C80

Description
SMJ320C80 Digital Signal Processor
Categorysemiconductor    The embedded processor and controller   
File Size3MB,158 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SMJ320C80 Overview

SMJ320C80 Digital Signal Processor

SMJ320C80 Parametric

Parameter NameAttribute value
MIPS60
Cycle time(ns)20
MOPS120
RatingMilitary
DMA(Ch)1
Operating temperature range(C)-55 to 125
Data/program memory space(words)2.4G
Package GroupCPGA|305
DSP MHz50

SMJ320C80 Related Products

SMJ320C80 5962-9679101QXA SM320C80GFM50 SM320C80HFHM50 SMJ320C80GFM50 SM320C80
Description SMJ320C80 Digital Signal Processor Digital Signal Processor 305-CPGA -55 to 125 Digital Signal Processors 305-CPGA -55 to 125 Digital Signal Processors 320-CFP -55 to 125 Digital Signal Processor 305-CPGA -55 to 125 SM320C80 Digital Signal Processors
Brand Name - Texas Instruments Texas Instruments Texas Instruments Texas Instruments -
Parts packaging code - PGA PGA QFP PGA -
package instruction - HIPGA, HSPGA305,35X35MOD HIPGA, HSPGA305,35X35MOD QFP-320 HIPGA, HSPGA305,35X35MOD -
Contacts - 305 305 320 305 -
Reach Compliance Code - not_compliant not_compliant not_compliant not_compliant -
ECCN code - 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C -
Address bus width - 32 32 32 32 -
barrel shifter - YES YES YES YES -
bit size - 32 32 32 32 -
boundary scan - YES YES YES YES -
maximum clock frequency - 50 MHz 50 MHz 50 MHz 50 MHz -
External data bus width - 64 64 64 64 -
Format - FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT -
Integrated cache - YES YES YES YES -
Internal bus architecture - MULTIPLE MULTIPLE MULTIPLE MULTIPLE -
JESD-30 code - S-CPGA-P305 S-CPGA-P305 S-CQFP-F320 S-CPGA-P305 -
length - 47.25 mm 47.25 mm 7.63 mm 47.25 mm -
low power mode - NO NO NO NO -
Number of DMA channels - 1 1 1 1 -
Number of external interrupt devices - 4 4 4 4 -
Number of terminals - 305 305 320 305 -
Number of timers - 3 3 3 3 -
On-chip data RAM width - 8 8 8 8 -
Maximum operating temperature - 125 °C 125 °C 125 °C 125 °C -
Minimum operating temperature - -55 °C -55 °C -55 °C -55 °C -
Package body material - CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED -
encapsulated code - HIPGA HIPGA GQFF HIPGA -
Encapsulate equivalent code - HSPGA305,35X35MOD HSPGA305,35X35MOD TPAK320,3SQ HSPGA305,35X35MOD -
Package shape - SQUARE SQUARE SQUARE SQUARE -
Package form - GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH FLATPACK, GUARD RING GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH -
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
power supply - 3.3 V 3.3 V 3.3 V 3.3 V -
Certification status - Qualified Not Qualified Not Qualified Not Qualified -
RAM (number of words) - 51200 51200 51200 51200 -
rom(word) - 2.4G 2.4G 2.4G 2.4G -
Maximum seat height - 5.59 mm 5.59 mm 4.55 mm 5.59 mm -
Maximum slew rate - 2500 mA 2500 mA 2500 mA 2500 mA -
Maximum supply voltage - 3.465 V 3.465 V 3.465 V 3.465 V -
Minimum supply voltage - 3.135 V 3.135 V 3.135 V 3.135 V -
Nominal supply voltage - 3.3 V 3.3 V 3.3 V 3.3 V -
surface mount - NO NO YES NO -
technology - CMOS CMOS CMOS CMOS -
Temperature level - MILITARY MILITARY MILITARY MILITARY -
Terminal form - PIN/PEG PIN/PEG FLAT PIN/PEG -
Terminal pitch - 1.27 mm 1.27 mm 0.5 mm 1.27 mm -
Terminal location - PERPENDICULAR PERPENDICULAR QUAD PERPENDICULAR -
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
width - 47.25 mm 47.25 mm 7.63 mm 47.25 mm -
uPs/uCs/peripheral integrated circuit type - DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER -
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