|
SMJ320C80 |
5962-9679101QXA |
SM320C80GFM50 |
SM320C80HFHM50 |
SMJ320C80GFM50 |
SM320C80 |
Description |
SMJ320C80 Digital Signal Processor |
Digital Signal Processor 305-CPGA -55 to 125 |
Digital Signal Processors 305-CPGA -55 to 125 |
Digital Signal Processors 320-CFP -55 to 125 |
Digital Signal Processor 305-CPGA -55 to 125 |
SM320C80 Digital Signal Processors |
Brand Name |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
Parts packaging code |
- |
PGA |
PGA |
QFP |
PGA |
- |
package instruction |
- |
HIPGA, HSPGA305,35X35MOD |
HIPGA, HSPGA305,35X35MOD |
QFP-320 |
HIPGA, HSPGA305,35X35MOD |
- |
Contacts |
- |
305 |
305 |
320 |
305 |
- |
Reach Compliance Code |
- |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
- |
ECCN code |
- |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
- |
Address bus width |
- |
32 |
32 |
32 |
32 |
- |
barrel shifter |
- |
YES |
YES |
YES |
YES |
- |
bit size |
- |
32 |
32 |
32 |
32 |
- |
boundary scan |
- |
YES |
YES |
YES |
YES |
- |
maximum clock frequency |
- |
50 MHz |
50 MHz |
50 MHz |
50 MHz |
- |
External data bus width |
- |
64 |
64 |
64 |
64 |
- |
Format |
- |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
- |
Integrated cache |
- |
YES |
YES |
YES |
YES |
- |
Internal bus architecture |
- |
MULTIPLE |
MULTIPLE |
MULTIPLE |
MULTIPLE |
- |
JESD-30 code |
- |
S-CPGA-P305 |
S-CPGA-P305 |
S-CQFP-F320 |
S-CPGA-P305 |
- |
length |
- |
47.25 mm |
47.25 mm |
7.63 mm |
47.25 mm |
- |
low power mode |
- |
NO |
NO |
NO |
NO |
- |
Number of DMA channels |
- |
1 |
1 |
1 |
1 |
- |
Number of external interrupt devices |
- |
4 |
4 |
4 |
4 |
- |
Number of terminals |
- |
305 |
305 |
320 |
305 |
- |
Number of timers |
- |
3 |
3 |
3 |
3 |
- |
On-chip data RAM width |
- |
8 |
8 |
8 |
8 |
- |
Maximum operating temperature |
- |
125 °C |
125 °C |
125 °C |
125 °C |
- |
Minimum operating temperature |
- |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
- |
Package body material |
- |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
- |
encapsulated code |
- |
HIPGA |
HIPGA |
GQFF |
HIPGA |
- |
Encapsulate equivalent code |
- |
HSPGA305,35X35MOD |
HSPGA305,35X35MOD |
TPAK320,3SQ |
HSPGA305,35X35MOD |
- |
Package shape |
- |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
- |
Package form |
- |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
FLATPACK, GUARD RING |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
- |
Peak Reflow Temperature (Celsius) |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
power supply |
- |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
- |
Certification status |
- |
Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
RAM (number of words) |
- |
51200 |
51200 |
51200 |
51200 |
- |
rom(word) |
- |
2.4G |
2.4G |
2.4G |
2.4G |
- |
Maximum seat height |
- |
5.59 mm |
5.59 mm |
4.55 mm |
5.59 mm |
- |
Maximum slew rate |
- |
2500 mA |
2500 mA |
2500 mA |
2500 mA |
- |
Maximum supply voltage |
- |
3.465 V |
3.465 V |
3.465 V |
3.465 V |
- |
Minimum supply voltage |
- |
3.135 V |
3.135 V |
3.135 V |
3.135 V |
- |
Nominal supply voltage |
- |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
- |
surface mount |
- |
NO |
NO |
YES |
NO |
- |
technology |
- |
CMOS |
CMOS |
CMOS |
CMOS |
- |
Temperature level |
- |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
- |
Terminal form |
- |
PIN/PEG |
PIN/PEG |
FLAT |
PIN/PEG |
- |
Terminal pitch |
- |
1.27 mm |
1.27 mm |
0.5 mm |
1.27 mm |
- |
Terminal location |
- |
PERPENDICULAR |
PERPENDICULAR |
QUAD |
PERPENDICULAR |
- |
Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
width |
- |
47.25 mm |
47.25 mm |
7.63 mm |
47.25 mm |
- |
uPs/uCs/peripheral integrated circuit type |
- |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
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