MSP430FR2532 datasheet, PDF - EEWORLD Datasheet

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MSP430FR2532: DescriptionMSP430FR2532 16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate Touch Technology; Categorysemiconductor The embedded processor and controller; File Size4MB，108 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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MSP430FR2532 Overview

MSP430FR2532 16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate Touch Technology

MSP430FR2532 Parametric

Parameter Name	Attribute value
Features	Real-Time Clock
SPI	1
I2C	1
Non-volatile memory (kB)	8
Package Group	VQFN\|24
Rating	Catalog
Timers - 16-bit	4
GPIO pins(#)	15
Special I/O	CapTIvate Touch I/O
ADC	10-bit SAR
Capacitive sensing I/O	8
Operating temperature range(C)	-40 to 85
Bootloader (BSL)	I2C,UART
RAM(KB)	1
Approx. price(US$)	0.95 \| 1ku
UART	2

MSP430FR2532 Related Products

	MSP430FR2532	MSP430FR2633IRHBR	MSP430FR2633IYQWT	MSP430FR2632IYQWR	MSP430FR2632IYQWT	MSP430FR2633IYQWR	MSP430FR2533	MSP430FR2632	MSP430FR2633
Description	MSP430FR2532 16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate Touch Technology	MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch 32-VQFN -40 to 85	MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch 24-DSBGA -40 to 85	16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate touch technology 24-DSBGA -40 to 85	16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate touch technology 24-DSBGA -40 to 85	MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch 24-DSBGA -40 to 85	MSP430FR2533 16 MHz Ultra-Low-Power Microcontroller with 16 KB FRAM, CapTIvate touch technology	MSP430FR2632 16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate touch technology	MSP430FR2633 MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch
Brand Name	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	-	-
Is it lead-free?	-	Lead free	Lead free	Lead free	Lead free	Lead free	-	-	-
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	conform to	-	-	-
Maker	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	-	-
package instruction	-	HVQCCN,	VFBGA,	VFBGA,	VFBGA,	VFBGA,	-	-	-
Reach Compliance Code	-	compliant	compliant	compliant	compliant	compliant	-	-	-
Factory Lead Time	-	6 weeks	6 weeks	6 weeks	6 weeks	6 weeks	-	-	-
Has ADC	-	YES	YES	YES	YES	YES	-	-	-
bit size	-	16	16	16	16	16	-	-	-
CPU series	-	MSP430	MSP430	MSP430	MSP430	MSP430	-	-	-
maximum clock frequency	-	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	-	-	-
DAC channel	-	NO	NO	NO	NO	NO	-	-	-
DMA channel	-	NO	NO	NO	NO	NO	-	-	-
JESD-30 code	-	S-PQCC-N32	R-PBGA-B24	R-PBGA-B24	R-PBGA-B24	R-PBGA-B24	-	-	-
JESD-609 code	-	e4	e1	e1	e1	e1	-	-	-
length	-	5 mm	2.34 mm	2.34 mm	2.34 mm	2.34 mm	-	-	-
Humidity sensitivity level	-	2	1	1	1	1	-	-	-
Number of I/O lines	-	19	17	17	17	17	-	-	-
Number of terminals	-	32	24	24	24	24	-	-	-
On-chip program ROM width	-	8	8	8	8	8	-	-	-
Maximum operating temperature	-	85 °C	85 °C	85 °C	85 °C	85 °C	-	-	-
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-	-
PWM channel	-	YES	YES	YES	YES	YES	-	-	-
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	-
encapsulated code	-	HVQCCN	VFBGA	VFBGA	VFBGA	VFBGA	-	-	-
Package shape	-	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-	-
Package form	-	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	-	-	-
RAM (bytes)	-	4096	4096	2048	2048	4096	-	-	-
rom(word)	-	15872	15872	8704	8704	15872	-	-	-
ROM programmability	-	FRAM	FRAM	FRAM	FRAM	FRAM	-	-	-
Maximum seat height	-	1 mm	0.625 mm	0.625 mm	0.625 mm	0.625 mm	-	-	-
speed	-	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	-	-	-
Maximum supply voltage	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-	-	-
Minimum supply voltage	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	-	-	-
Nominal supply voltage	-	2 V	3 V	3 V	3 V	3 V	-	-	-
surface mount	-	YES	YES	YES	YES	YES	-	-	-
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	-	-	-
Temperature level	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	-	-
Terminal surface	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-
Terminal form	-	NO LEAD	BALL	BALL	BALL	BALL	-	-	-
Terminal pitch	-	0.5 mm	0.4 mm	0.4 mm	0.4 mm	0.4 mm	-	-	-
Terminal location	-	QUAD	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-	-	-
width	-	5 mm	2.29 mm	2.29 mm	2.29 mm	2.29 mm	-	-	-
uPs/uCs/peripheral integrated circuit type	-	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-	-	-

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