MSP430FR2633IRHBR datasheet, PDF

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MSP430FR2633IRHBR: DescriptionMSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch 32-VQFN -40 to 85; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，108 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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MSP430FR2633IRHBR Overview

MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch 32-VQFN -40 to 85

MSP430FR2633IRHBR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
package instruction	HVQCCN,
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	6 weeks
Has ADC	YES
Other features	ALSO HAVING 512 BYTES OF INFORMATION FRAM
Address bus width
bit size	16
CPU series	MSP430
maximum clock frequency	16 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQCC-N32
JESD-609 code	e4
length	5 mm
Humidity sensitivity level	2
Number of I/O lines	19
Number of terminals	32
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
RAM (bytes)	4096
rom(word)	15872
ROM programmability	FRAM
Maximum seat height	1 mm
speed	16 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	1.8 V
Nominal supply voltage	2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
width	5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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Description	MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch 32-VQFN -40 to 85	MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch 24-DSBGA -40 to 85	16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate touch technology 24-DSBGA -40 to 85	16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate touch technology 24-DSBGA -40 to 85	MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch 24-DSBGA -40 to 85	MSP430FR2532 16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate Touch Technology	MSP430FR2533 16 MHz Ultra-Low-Power Microcontroller with 16 KB FRAM, CapTIvate touch technology	MSP430FR2632 16 MHz Ultra-Low-Power Microcontroller With 8 KB FRAM, CapTIvate touch technology	MSP430FR2633 MSP430 MCU with CapTIvate technology - the lowest power, most noise-immune capacitive touch
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	-	-	-
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	-	-	-	-
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	-	-	-	-
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	-	-	-
package instruction	HVQCCN,	VFBGA,	VFBGA,	VFBGA,	VFBGA,	-	-	-	-
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	-	-	-	-
Factory Lead Time	6 weeks	6 weeks	6 weeks	6 weeks	6 weeks	-	-	-	-
Has ADC	YES	YES	YES	YES	YES	-	-	-	-
bit size	16	16	16	16	16	-	-	-	-
CPU series	MSP430	MSP430	MSP430	MSP430	MSP430	-	-	-	-
maximum clock frequency	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	-	-	-	-
DAC channel	NO	NO	NO	NO	NO	-	-	-	-
DMA channel	NO	NO	NO	NO	NO	-	-	-	-
JESD-30 code	S-PQCC-N32	R-PBGA-B24	R-PBGA-B24	R-PBGA-B24	R-PBGA-B24	-	-	-	-
JESD-609 code	e4	e1	e1	e1	e1	-	-	-	-
length	5 mm	2.34 mm	2.34 mm	2.34 mm	2.34 mm	-	-	-	-
Humidity sensitivity level	2	1	1	1	1	-	-	-	-
Number of I/O lines	19	17	17	17	17	-	-	-	-
Number of terminals	32	24	24	24	24	-	-	-	-
On-chip program ROM width	8	8	8	8	8	-	-	-	-
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	-	-	-	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-	-	-
PWM channel	YES	YES	YES	YES	YES	-	-	-	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	-	-
encapsulated code	HVQCCN	VFBGA	VFBGA	VFBGA	VFBGA	-	-	-	-
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-	-	-
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	-	-	-	-
RAM (bytes)	4096	4096	2048	2048	4096	-	-	-	-
rom(word)	15872	15872	8704	8704	15872	-	-	-	-
ROM programmability	FRAM	FRAM	FRAM	FRAM	FRAM	-	-	-	-
Maximum seat height	1 mm	0.625 mm	0.625 mm	0.625 mm	0.625 mm	-	-	-	-
speed	16 MHz	16 MHz	16 MHz	16 MHz	16 MHz	-	-	-	-
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-	-	-	-
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	-	-	-	-
Nominal supply voltage	2 V	3 V	3 V	3 V	3 V	-	-	-	-
surface mount	YES	YES	YES	YES	YES	-	-	-	-
technology	CMOS	CMOS	CMOS	CMOS	CMOS	-	-	-	-
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	-	-	-
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	-
Terminal form	NO LEAD	BALL	BALL	BALL	BALL	-	-	-	-
Terminal pitch	0.5 mm	0.4 mm	0.4 mm	0.4 mm	0.4 mm	-	-	-	-
Terminal location	QUAD	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-	-	-	-
width	5 mm	2.29 mm	2.29 mm	2.29 mm	2.29 mm	-	-	-	-
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-	-	-	-

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