1M x 16Bit EDO DRAM
| HY51V18163HGT | HY51V18163HGJ-5 | HY51V18163HGJ-6 | HY51V18163HGJ-7 | HY51V18163HGJ | HY51V18163HGT-6 | HY51V18163HGT-5 | HY51V18163HGT-7 | HY51VS18163HG | |
|---|---|---|---|---|---|---|---|---|---|
| Description | 1M x 16Bit EDO DRAM | 1M x 16Bit EDO DRAM | 1M x 16Bit EDO DRAM | 1M x 16Bit EDO DRAM | 1M x 16Bit EDO DRAM | 1M x 16Bit EDO DRAM | 1M x 16Bit EDO DRAM | 1M x 16Bit EDO DRAM | 1M x 16Bit EDO DRAM |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | - | incompatible | incompatible | incompatible | - |
| Maker | - | SK Hynix | SK Hynix | SK Hynix | - | SK Hynix | SK Hynix | SK Hynix | - |
| Parts packaging code | - | SOJ | SOJ | SOJ | - | TSOP2 | TSOP2 | TSOP2 | - |
| package instruction | - | SOJ, SOJ42,.44 | SOJ, SOJ42,.44 | SOJ, SOJ42,.44 | - | TSOP2, TSOP44/50,.46,32 | TSOP2, TSOP44/50,.46,32 | TSOP2, TSOP44/50,.46,32 | - |
| Contacts | - | 42 | 42 | 42 | - | 50 | 50 | 50 | - |
| Reach Compliance Code | - | compli | compli | compli | - | compli | compli | compli | - |
| ECCN code | - | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | - |
| access mode | - | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | - | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | - |
| Maximum access time | - | 50 ns | 60 ns | 70 ns | - | 60 ns | 50 ns | 70 ns | - |
| Other features | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | - |
| I/O type | - | COMMON | COMMON | COMMON | - | COMMON | COMMON | COMMON | - |
| JESD-30 code | - | R-PDSO-J42 | R-PDSO-J42 | R-PDSO-J42 | - | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | - |
| JESD-609 code | - | e0 | e0 | e0 | - | e0 | e0 | e0 | - |
| length | - | 27.06 mm | 27.06 mm | 27.06 mm | - | 20.95 mm | 20.95 mm | 20.95 mm | - |
| memory density | - | 16777216 bi | 16777216 bi | 16777216 bi | - | 16777216 bi | 16777216 bi | 16777216 bi | - |
| Memory IC Type | - | EDO DRAM | EDO DRAM | EDO DRAM | - | EDO DRAM | EDO DRAM | EDO DRAM | - |
| memory width | - | 16 | 16 | 16 | - | 16 | 16 | 16 | - |
| Number of functions | - | 1 | 1 | 1 | - | 1 | 1 | 1 | - |
| Number of ports | - | 1 | 1 | 1 | - | 1 | 1 | 1 | - |
| Number of terminals | - | 42 | 42 | 42 | - | 44 | 44 | 44 | - |
| word count | - | 1048576 words | 1048576 words | 1048576 words | - | 1048576 words | 1048576 words | 1048576 words | - |
| character code | - | 1000000 | 1000000 | 1000000 | - | 1000000 | 1000000 | 1000000 | - |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C | - |
| organize | - | 1MX16 | 1MX16 | 1MX16 | - | 1MX16 | 1MX16 | 1MX16 | - |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | - |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | - | SOJ | SOJ | SOJ | - | TSOP2 | TSOP2 | TSOP2 | - |
| Encapsulate equivalent code | - | SOJ42,.44 | SOJ42,.44 | SOJ42,.44 | - | TSOP44/50,.46,32 | TSOP44/50,.46,32 | TSOP44/50,.46,32 | - |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| power supply | - | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | - |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
| refresh cycle | - | 1024 | 1024 | 1024 | - | 1024 | 1024 | 1024 | - |
| Maximum seat height | - | 3.76 mm | 3.76 mm | 3.76 mm | - | 1.2 mm | 1.2 mm | 1.2 mm | - |
| self refresh | - | NO | NO | NO | - | NO | NO | NO | - |
| Maximum standby current | - | 0.001 A | 0.001 A | 0.001 A | - | 0.001 A | 0.001 A | 0.001 A | - |
| Maximum slew rate | - | 0.19 mA | 0.17 mA | 0.15 mA | - | 0.17 mA | 0.19 mA | 0.15 mA | - |
| Maximum supply voltage (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | - |
| Minimum supply voltage (Vsup) | - | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V | - |
| Nominal supply voltage (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | - |
| surface mount | - | YES | YES | YES | - | YES | YES | YES | - |
| technology | - | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | - |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | - | J BEND | J BEND | J BEND | - | GULL WING | GULL WING | GULL WING | - |
| Terminal pitch | - | 1.27 mm | 1.27 mm | 1.27 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | - |
| Terminal location | - | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | - |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| width | - | 10.16 mm | 10.16 mm | 10.16 mm | - | 10.16 mm | 10.16 mm | 10.16 mm | - |
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