HY51V18163HGT-6 datasheet, PDF

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HY51V18163HGT-6: Description1M x 16Bit EDO DRAM; Categorystorage storage; File Size86KB，12 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY51V18163HGT-6 Overview

1M x 16Bit EDO DRAM

HY51V18163HGT-6 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SK Hynix
Parts packaging code	TSOP2
package instruction	TSOP2, TSOP44/50,.46,32
Contacts	50
Reach Compliance Code	compli
ECCN code	EAR99
access mode	FAST PAGE WITH EDO
Maximum access time	60 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	COMMON
JESD-30 code	R-PDSO-G44
JESD-609 code	e0
length	20.95 mm
memory density	16777216 bi
Memory IC Type	EDO DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	44
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP44/50,.46,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	1024
Maximum seat height	1.2 mm
self refresh	NO
Maximum standby current	0.001 A
Maximum slew rate	0.17 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm

HY51V18163HGT-6 Related Products

	HY51V18163HGT-6	HY51V18163HGJ-5	HY51V18163HGJ-6	HY51V18163HGJ-7	HY51V18163HGT	HY51V18163HGJ	HY51V18163HGT-5	HY51V18163HGT-7	HY51VS18163HG
Description	1M x 16Bit EDO DRAM	1M x 16Bit EDO DRAM	1M x 16Bit EDO DRAM	1M x 16Bit EDO DRAM	1M x 16Bit EDO DRAM	1M x 16Bit EDO DRAM	1M x 16Bit EDO DRAM	1M x 16Bit EDO DRAM	1M x 16Bit EDO DRAM
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	-	-	incompatible	incompatible	-
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix	-	-	SK Hynix	SK Hynix	-
Parts packaging code	TSOP2	SOJ	SOJ	SOJ	-	-	TSOP2	TSOP2	-
package instruction	TSOP2, TSOP44/50,.46,32	SOJ, SOJ42,.44	SOJ, SOJ42,.44	SOJ, SOJ42,.44	-	-	TSOP2, TSOP44/50,.46,32	TSOP2, TSOP44/50,.46,32	-
Contacts	50	42	42	42	-	-	50	50	-
Reach Compliance Code	compli	compli	compli	compli	-	-	compli	compli	-
ECCN code	EAR99	EAR99	EAR99	EAR99	-	-	EAR99	EAR99	-
access mode	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	FAST PAGE WITH EDO	-	-	FAST PAGE WITH EDO	FAST PAGE WITH EDO	-
Maximum access time	60 ns	50 ns	60 ns	70 ns	-	-	50 ns	70 ns	-
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	-	-	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	-
I/O type	COMMON	COMMON	COMMON	COMMON	-	-	COMMON	COMMON	-
JESD-30 code	R-PDSO-G44	R-PDSO-J42	R-PDSO-J42	R-PDSO-J42	-	-	R-PDSO-G44	R-PDSO-G44	-
JESD-609 code	e0	e0	e0	e0	-	-	e0	e0	-
length	20.95 mm	27.06 mm	27.06 mm	27.06 mm	-	-	20.95 mm	20.95 mm	-
memory density	16777216 bi	16777216 bi	16777216 bi	16777216 bi	-	-	16777216 bi	16777216 bi	-
Memory IC Type	EDO DRAM	EDO DRAM	EDO DRAM	EDO DRAM	-	-	EDO DRAM	EDO DRAM	-
memory width	16	16	16	16	-	-	16	16	-
Number of functions	1	1	1	1	-	-	1	1	-
Number of ports	1	1	1	1	-	-	1	1	-
Number of terminals	44	42	42	42	-	-	44	44	-
word count	1048576 words	1048576 words	1048576 words	1048576 words	-	-	1048576 words	1048576 words	-
character code	1000000	1000000	1000000	1000000	-	-	1000000	1000000	-
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	-	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	-	-	70 °C	70 °C	-
organize	1MX16	1MX16	1MX16	1MX16	-	-	1MX16	1MX16	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	-	-	3-STATE	3-STATE	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TSOP2	SOJ	SOJ	SOJ	-	-	TSOP2	TSOP2	-
Encapsulate equivalent code	TSOP44/50,.46,32	SOJ42,.44	SOJ42,.44	SOJ42,.44	-	-	TSOP44/50,.46,32	TSOP44/50,.46,32	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	-	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED	NOT SPECIFIED	-
power supply	3.3 V	3.3 V	3.3 V	3.3 V	-	-	3.3 V	3.3 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified	Not Qualified	-
refresh cycle	1024	1024	1024	1024	-	-	1024	1024	-
Maximum seat height	1.2 mm	3.76 mm	3.76 mm	3.76 mm	-	-	1.2 mm	1.2 mm	-
self refresh	NO	NO	NO	NO	-	-	NO	NO	-
Maximum standby current	0.001 A	0.001 A	0.001 A	0.001 A	-	-	0.001 A	0.001 A	-
Maximum slew rate	0.17 mA	0.19 mA	0.17 mA	0.15 mA	-	-	0.19 mA	0.15 mA	-
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	-	-	3.6 V	3.6 V	-
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	-	-	3 V	3 V	-
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	-	-	3.3 V	3.3 V	-
surface mount	YES	YES	YES	YES	-	-	YES	YES	-
technology	CMOS	CMOS	CMOS	CMOS	-	-	CMOS	CMOS	-
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	-	COMMERCIAL	COMMERCIAL	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	GULL WING	J BEND	J BEND	J BEND	-	-	GULL WING	GULL WING	-
Terminal pitch	0.8 mm	1.27 mm	1.27 mm	1.27 mm	-	-	0.8 mm	0.8 mm	-
Terminal location	DUAL	DUAL	DUAL	DUAL	-	-	DUAL	DUAL	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED	NOT SPECIFIED	-
width	10.16 mm	10.16 mm	10.16 mm	10.16 mm	-	-	10.16 mm	10.16 mm	-

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