SINGLE CHIP 16 BIT CMOS MICROCOMPUTER
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Mitsubishi |
| Objectid | 1416116939 |
| Parts packaging code | DIP |
| package instruction | SDIP, SDIP64,.75 |
| Contacts | 64 |
| Reach Compliance Code | unknow |
| compound_id | 11113120 |
| Has ADC | YES |
| Other features | 2V DATA RETENTION |
| Address bus width | 24 |
| bit size | 16 |
| boundary scan | NO |
| CPU series | MELPS7700 |
| maximum clock frequency | 16.13 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 16 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | R-PDIP-T64 |
| JESD-609 code | e0 |
| length | 56.4 mm |
| low power mode | YES |
| Number of DMA channels | |
| Number of external interrupt devices | 2 |
| Number of I/O lines | 53 |
| Number of serial I/Os | 1 |
| Number of terminals | 64 |
| Number of timers | 8 |
| On-chip data RAM width | 8 |
| On-chip program ROM width | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -20 °C |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SDIP |
| Encapsulate equivalent code | SDIP64,.75 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 512 |
| RAM (number of words) | 512 |
| rom(word) | 16000 |
| ROM programmability | MROM |
| Maximum seat height | 5.08 mm |
| speed | 16 MHz |
| Maximum slew rate | 24 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.778 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 19.05 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| M37705M2AXXXSP | M37705S1ASP | |
|---|---|---|
| Description | SINGLE CHIP 16 BIT CMOS MICROCOMPUTER | SINGLE CHIP 16 BIT CMOS MICROCOMPUTER |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Mitsubishi | Mitsubishi |
| Parts packaging code | DIP | DIP |
| package instruction | SDIP, SDIP64,.75 | 0.750 INCH, 1.778 MM PITCH, SHRINK, PLASTIC, DIP-64 |
| Contacts | 64 | 64 |
| Reach Compliance Code | unknow | unknow |
| Has ADC | YES | YES |
| Other features | 2V DATA RETENTION | 2V DATA RETENTION |
| Address bus width | 24 | 24 |
| bit size | 16 | 16 |
| boundary scan | NO | NO |
| CPU series | MELPS7700 | MELPS7700 |
| maximum clock frequency | 16.13 MHz | 16.13 MHz |
| DAC channel | NO | NO |
| DMA channel | NO | NO |
| External data bus width | 16 | 16 |
| Format | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO |
| JESD-30 code | R-PDIP-T64 | R-PDIP-T64 |
| JESD-609 code | e0 | e0 |
| length | 56.4 mm | 56.4 mm |
| low power mode | YES | YES |
| Number of external interrupt devices | 2 | 2 |
| Number of I/O lines | 53 | 53 |
| Number of serial I/Os | 1 | 1 |
| Number of terminals | 64 | 64 |
| Number of timers | 8 | 8 |
| On-chip data RAM width | 8 | 8 |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -20 °C | -20 °C |
| PWM channel | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SDIP | SDIP |
| Encapsulate equivalent code | SDIP64,.75 | SDIP64,.75 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| RAM (bytes) | 512 | 512 |
| RAM (number of words) | 512 | 512 |
| Maximum seat height | 5.08 mm | 5.08 mm |
| speed | 16 MHz | 16 MHz |
| Maximum slew rate | 24 mA | 24 mA |
| Maximum supply voltage | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | OTHER | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.778 mm | 1.778 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 19.05 mm | 19.05 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER |
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