M37705S1ASP datasheet, PDF - EEWORLD Datasheet

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M37705S1ASP: DescriptionSINGLE CHIP 16 BIT CMOS MICROCOMPUTER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，20 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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M37705S1ASP Overview

SINGLE CHIP 16 BIT CMOS MICROCOMPUTER

M37705S1ASP Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Mitsubishi
Parts packaging code	DIP
package instruction	0.750 INCH, 1.778 MM PITCH, SHRINK, PLASTIC, DIP-64
Contacts	64
Reach Compliance Code	unknow
Has ADC	YES
Other features	2V DATA RETENTION
Address bus width	24
bit size	16
boundary scan	NO
CPU series	MELPS7700
maximum clock frequency	16.13 MHz
DAC channel	NO
DMA channel	NO
External data bus width	16
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	R-PDIP-T64
JESD-609 code	e0
length	56.4 mm
low power mode	YES
Number of DMA channels
Number of external interrupt devices	2
Number of I/O lines	53
Number of serial I/Os	1
Number of terminals	64
Number of timers	8
On-chip data RAM width	8
On-chip program ROM width
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	SDIP
Encapsulate equivalent code	SDIP64,.75
Package shape	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	512
RAM (number of words)	512
rom(word)	0
Maximum seat height	5.08 mm
speed	16 MHz
Maximum slew rate	24 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.778 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	19.05 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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M37705S1ASP Related Products

	M37705S1ASP	M37705M2AXXXSP
Description	SINGLE CHIP 16 BIT CMOS MICROCOMPUTER	SINGLE CHIP 16 BIT CMOS MICROCOMPUTER
Is it Rohs certified?	incompatible	incompatible
Maker	Mitsubishi	Mitsubishi
Parts packaging code	DIP	DIP
package instruction	0.750 INCH, 1.778 MM PITCH, SHRINK, PLASTIC, DIP-64	SDIP, SDIP64,.75
Contacts	64	64
Reach Compliance Code	unknow	unknow
Has ADC	YES	YES
Other features	2V DATA RETENTION	2V DATA RETENTION
Address bus width	24	24
bit size	16	16
boundary scan	NO	NO
CPU series	MELPS7700	MELPS7700
maximum clock frequency	16.13 MHz	16.13 MHz
DAC channel	NO	NO
DMA channel	NO	NO
External data bus width	16	16
Format	FIXED POINT	FIXED POINT
Integrated cache	NO	NO
JESD-30 code	R-PDIP-T64	R-PDIP-T64
JESD-609 code	e0	e0
length	56.4 mm	56.4 mm
low power mode	YES	YES
Number of external interrupt devices	2	2
Number of I/O lines	53	53
Number of serial I/Os	1	1
Number of terminals	64	64
Number of timers	8	8
On-chip data RAM width	8	8
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-20 °C	-20 °C
PWM channel	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SDIP	SDIP
Encapsulate equivalent code	SDIP64,.75	SDIP64,.75
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH	IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
RAM (bytes)	512	512
RAM (number of words)	512	512
Maximum seat height	5.08 mm	5.08 mm
speed	16 MHz	16 MHz
Maximum slew rate	24 mA	24 mA
Maximum supply voltage	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.778 mm	1.778 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	19.05 mm	19.05 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER

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