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DM54ALS810J/883

Description
IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,CERAMIC
Categorylogic    logic   
File Size155KB,3 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

DM54ALS810J/883 Overview

IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,CERAMIC

DM54ALS810J/883 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
Reach Compliance Codecompliant
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Logic integrated circuit typeXNOR GATE
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Schmitt triggerNO
Filter level38535Q/M;38534H;883B
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

DM54ALS810J/883 Related Products

DM54ALS810J/883 DM54ALS810J/883C DM74ALS810M/A+ DM74ALS810M/B+ DM74ALS810N/A+ DM74ALS810N/B+
Description IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,CERAMIC IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,CERAMIC IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,SOP,14PIN,PLASTIC IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,SOP,14PIN,PLASTIC IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,PLASTIC IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code compliant compliant unknown unknown unknown unknown
JESD-30 code R-XDIP-T14 R-XDIP-T14 R-PDSO-G14 R-PDSO-G14 R-PDIP-T14 R-PDIP-T14
JESD-609 code e0 e0 e0 e0 e0 e0
Logic integrated circuit type XNOR GATE XNOR GATE XNOR GATE XNOR GATE XNOR GATE XNOR GATE
Number of terminals 14 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP SOP SOP DIP DIP
Encapsulate equivalent code DIP14,.3 DIP14,.3 SOP14,.25 SOP14,.25 DIP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE
Schmitt trigger NO NO NO NO NO NO
surface mount NO NO YES YES NO NO
technology TTL TTL TTL TTL TTL TTL
Temperature level MILITARY MILITARY COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maker National Semiconductor(TI ) National Semiconductor(TI ) - - National Semiconductor(TI ) National Semiconductor(TI )
Certification status Not Qualified Not Qualified - Not Qualified - Not Qualified
Base Number Matches 1 1 1 1 - -
package instruction - - SOP, SOP14,.25 SOP, SOP14,.25 DIP, DIP14,.3 DIP, DIP14,.3
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