IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
Reach Compliance Code | compliant |
JESD-30 code | R-XDIP-T14 |
JESD-609 code | e0 |
Logic integrated circuit type | XNOR GATE |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
Schmitt trigger | NO |
Filter level | 38535Q/M;38534H;883B |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
DM54ALS810J/883 | DM54ALS810J/883C | DM74ALS810M/A+ | DM74ALS810M/B+ | DM74ALS810N/A+ | DM74ALS810N/B+ | |
---|---|---|---|---|---|---|
Description | IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,SOP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,SOP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | compliant | compliant | unknown | unknown | unknown | unknown |
JESD-30 code | R-XDIP-T14 | R-XDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDIP-T14 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Logic integrated circuit type | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | SOP | SOP | DIP | DIP |
Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | SOP14,.25 | SOP14,.25 | DIP14,.3 | DIP14,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
Schmitt trigger | NO | NO | NO | NO | NO | NO |
surface mount | NO | NO | YES | YES | NO | NO |
technology | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | National Semiconductor(TI ) | National Semiconductor(TI ) | - | - | National Semiconductor(TI ) | National Semiconductor(TI ) |
Certification status | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |
package instruction | - | - | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP14,.3 | DIP, DIP14,.3 |