DM74ALS810N/B+ datasheet, PDF - EEWORLD Datasheet

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DM74ALS810N/B+: DescriptionIC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,PLASTIC; Categorylogic logic; File Size155KB，3 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DM74ALS810N/B+ Overview

IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,PLASTIC

DM74ALS810N/B+ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T14
JESD-609 code	e0
Logic integrated circuit type	XNOR GATE
Number of terminals	14
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

DM74ALS810N/B+ Related Products

	DM74ALS810N/B+	DM54ALS810J/883C	DM54ALS810J/883	DM74ALS810M/A+	DM74ALS810M/B+	DM74ALS810N/A+
Description	IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,PLASTIC	IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,CERAMIC	IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,CERAMIC	IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,SOP,14PIN,PLASTIC	IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,SOP,14PIN,PLASTIC	IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	compliant	compliant	unknown	unknown	unknown
JESD-30 code	R-PDIP-T14	R-XDIP-T14	R-XDIP-T14	R-PDSO-G14	R-PDSO-G14	R-PDIP-T14
JESD-609 code	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	XNOR GATE	XNOR GATE	XNOR GATE	XNOR GATE	XNOR GATE	XNOR GATE
Number of terminals	14	14	14	14	14	14
Maximum operating temperature	70 °C	125 °C	125 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	SOP	SOP	DIP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	DIP14,.3	SOP14,.25	SOP14,.25	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Schmitt trigger	NO	NO	NO	NO	NO	NO
surface mount	NO	NO	NO	YES	YES	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	-	-	National Semiconductor（TI ）
package instruction	DIP, DIP14,.3	-	-	SOP, SOP14,.25	SOP, SOP14,.25	DIP, DIP14,.3
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-
Base Number Matches	-	1	1	1	1	-

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